TechNavio’s analysts forecast the Global Electronic Packaging market will grow at a CAGR of 46.79 percent over the period 2013-2018. One of the key factors contributing to this market growth is the increasing thefts and counterfeiting practices. The Global Electronic Packaging market has also been witnessing a rising number of innovations. However, lack of awareness about the potential of electronic packaging could pose a challenge to the growth of this market.... Research Beam Model: Research Beam Product ID: 17695 2500 USD New
Global Electronic Packaging Market 2014-2018
 
 

Global Electronic Packaging Market 2014-2018

  • Category : Food and Beverages
  • Published On : February   2014
  • Pages : 55
  • Publisher : Technavio
 
 
 

TechNavio’s analysts forecast the Global Electronic Packaging market will grow at a CAGR of 46.79 percent over the period 2013-2018. One of the key factors contributing to this market growth is the increasing thefts and counterfeiting practices. The Global Electronic Packaging market has also been witnessing a rising number of innovations. However, lack of awareness about the potential of electronic packaging could pose a challenge to the growth of this market. 

TechNavio’s report, Global Electronic Packaging Market 2014-2018, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the Americas, the EMEA region, and the APAC region; it also covers the Global Electronic Packaging market landscape and its growth prospects in the coming years. The report also includes a discussion of the key vendors operating in this market.

The key vendors dominating this space are BASF SE, Enfucell Ltd., MeadWestvaco Corp., Soligie Inc., and T-Ink Inc.

The other vendors mentioned in the report are Acreo Swedish ICT, Blue Spark Technologies, Canatu Ltd., Cap-XX Ltd., Cymbet Corp., Excellatron Solid State LLC, Fraunhofer Institute for Electronic Nano Systems, Front Edge Technology Inc., Holst Centre, Infinite Power Solutions Inc., Infratab Inc., Institute of Bioengineering and Nanotechnology , ISORG, Kovio Inc., Massachusetts Institute of Technology, NEC Corp., Novalia Ltd., Plastic Logic Ltd., PragmatIC Printing Ltd., Printechnologics GmbH, PST Sensors, Solarmer Energy Inc., The Universidade Nova de Lisboa, Thin Film Electronics ASA, and VTT Technical Research Centre of Finland

Key questions answered in this report: 

What will the market size be in 2018 and at what rate will it grow?

What are the key market trends?

What is driving this market?

What are the challenges to market growth?

Who are the key vendors in this market space?

What are the market opportunities and threats faced by the key vendors?

What are the strengths and weaknesses of the key vendors?

You can request one free hour of our analyst’s time when you purchase this market report. Details provided within the report.



 


01. Executive Summary

02. List of Abbreviations

03. Scope of the Report


03.1 Market Overview

03.2 Product Offerings

04. Market Research Methodology

04.1 Market Research Process

04.2 Research Methodology

05. Introduction

06. Market Landscape


06.1 Market Overview

06.2 Market Size and Forecast by Revenue

06.3 Market Size and Forecast by Volume

06.4 Five Forces Analysis

07. Market Segmentation by Technology

07.1 Global Electronic Packaging Market by Technology 2013

08. Market Segmentation by Function

08.1 Global Electronic Packaging Market by Product 2013

09. Geographical Segmentation

09.1 Global Electronic Packaging Market by Geographical Segmentation 2013

10. Buying Criteria

11. Market Growth Drivers

12. Drivers and their Impact

13. Market Challenges

14. Impact of Drivers and Challenges

15. Market Trends

16. Trends and their Impact

17. Vendor Landscape


17.1 Competitive Scenario

17.2 Key Vendor Analysis 2013

17.3 Other Prominent Vendors

18. Key Vendor Analysis

18.1 BASF SE

18.1.1 Business Overview

18.1.2 Business Segmentation

18.1.3 Key Information

18.1.4 SWOT Analysis

18.2 Enfucell Ltd.

18.2.1 Business Overview

18.2.2 Business Segmentation

18.2.3 Key Information

18.2.4 SWOT Analysis

18.3 MeadWestvaco Corp.

18.3.1 Business Overview

18.3.2 Business Segmentation

18.3.3 Key Information

18.3.4 SWOT Analysis

18.4 Soligie Inc.

18.4.1 Business Overview

18.4.2 Key Information

18.4.3 SWOT Analysis

18.5 T-Ink Inc.

18.5.1 Business Overview

18.5.2 Business Segmentation

18.5.3 Key Information

18.5.4 SWOT Analysis

19. Other Reports in this Series



List of Exhibits

Exhibit 1: Market Research Methodology

Exhibit 2: Global Electronic Packaging Market

Exhibit 3: Global Electronic Packaging Market 2013-2018 (US$ million)

Exhibit 4: Global Electronic Packaging Market 2013-2018 (billion units)

Exhibit 5: Global Electronic Packaging Market by Technology 2013

Exhibit 6: Global Electronic Packaging Market by Technology 2013-2018

Exhibit 7: Global Electronic Packaging Market by Technology 2013 (by Volume)

Exhibit 8: Global Electronic Packaging Market by Function Segmentation 2013

Exhibit 9: Global Electronic Packaging Market by Geographical Segmentation 2013

Exhibit 10: Business Segmentation of BASF SE

Exhibit 11: Business Segmentation of Enfucell Ltd.

Exhibit 12: Business Segmentation of MeadWestvaco Corp.

Exhibit 13: Business Segmentation of T-Ink Inc.



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