TechNavio’s analysts forecast the Global Electronic Packaging market will grow at a CAGR of 46.79 percent over the period 2013-2018. One of the key factors contributing to this market growth is the increasing thefts and counterfeiting practices. The Global Electronic Packaging market has also been witnessing a rising number of innovations. However, lack of awareness about the potential of electronic packaging could pose a challenge to the growth of this market.
TechNavio’s report, Global Electronic Packaging Market 2014-2018, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the Americas, the EMEA region, and the APAC region; it also covers the Global Electronic Packaging market landscape and its growth prospects in the coming years. The report also includes a discussion of the key vendors operating in this market.
The key vendors dominating this space are BASF SE, Enfucell Ltd., MeadWestvaco Corp., Soligie Inc., and T-Ink Inc.
The other vendors mentioned in the report are Acreo Swedish ICT, Blue Spark Technologies, Canatu Ltd., Cap-XX Ltd., Cymbet Corp., Excellatron Solid State LLC, Fraunhofer Institute for Electronic Nano Systems, Front Edge Technology Inc., Holst Centre, Infinite Power Solutions Inc., Infratab Inc., Institute of Bioengineering and Nanotechnology , ISORG, Kovio Inc., Massachusetts Institute of Technology, NEC Corp., Novalia Ltd., Plastic Logic Ltd., PragmatIC Printing Ltd., Printechnologics GmbH, PST Sensors, Solarmer Energy Inc., The Universidade Nova de Lisboa, Thin Film Electronics ASA, and VTT Technical Research Centre of Finland
Key questions answered in this report:
What will the market size be in 2018 and at what rate will it grow?
What are the key market trends?
What is driving this market?
What are the challenges to market growth?
Who are the key vendors in this market space?
What are the market opportunities and threats faced by the key vendors?
What are the strengths and weaknesses of the key vendors?
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