About Wafer-Level Manufacturing Equipment
The wafer-level manufacturing equipment is used for the production of semiconductor wafers, which includes processes such as lithography, etching and stripping, inspection, and packaging. The growing number of applications of semiconductor ICs across different segments has led to the increased demand for wafer-level manufacturing equipment.
Technavios analysts forecast the global wafer-level manufacturing equipment market to grow at a CAGR of 4.2% during the period 2016-2020.
Covered in this report
The report covers the present scenario and the growth prospects of the global wafer-level manufacturing equipment market for 2016-2020. To calculate the market size, the report considers the revenue generated from the sales of the wafer fab equipment and wafer-level packaging and assembly equipment to the following customer segments:
Foundries
Memory device manufacturers
Integrated device manufacturers (IDM)
Technavios report, Global Wafer-Level Manufacturing Equipment Market 2016-2020, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.
Key vendors
Applied Materials
ASML
TEL
Lam Research
KLA-Tencor
Other prominent vendors
Dainippon
Advantest
Canon
Hitachi
JEOL.
Market driver
Growing applications of semiconductor ICs in IoT
For a full, detailed list, view our report
Market challenge
High initial capital investment
For a full, detailed list, view our report
Market trend
Increase in wafer size
For a full, detailed list, view our report
Key questions answered in this report
What will the market size be in 2020 and what will the growth rate be?
What are the key market trends?
What is driving this market?
What are the challenges to market growth?
Who are the key vendors in this market space?
What are the market opportunities and threats faced by the key vendors?
What are the strengths and weaknesses of the key vendors?
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PART 01: Executive summary
Highlights
PART 02: Scope of the report
Market overview
Top-vendor offerings
PART 03: Market research methodology
Research methodology
Economic indicators
PEST analysis
PART 04: Introduction
Key market highlights
PART 05: Technology landscape
Semiconductor IC manufacturing process
Wafer-level manufacturing equipment categories
PART 06: Market landscape
Customer perspective
Market size and forecast
Five forces analysis
PART 07: Market segmentation by product
Market overview
Global wafer fab equipment market
Global wafer-level packaging and assembly equipment market
PART 08: Market segmentation by users
Market overview
Market size and forecast
PART 09: Geographical segmentation
Market overview
Market size and forecast
PART 10: Market drivers
Impact of drivers
PART 11: Market challenges
PART 12: Impact of drivers and challenges
PART 13: Market trends
PART 14: Vendor landscape
Competitive scenario
Key vendors
Other prominent vendors
PART 15: Key vendor analysis
Applied Materials
ASML
KLA-Tencor
Lam Research
Tokyo Electron
PART 16: Key recommendations for vendors/investors
PART 17: Appendix
List of abbreviations
PART 18: Explore Technavio
List of Exhibits
Exhibit 01: Global wafer-level manufacturing equipment market segments: A snapshot
Exhibit 02: Product offerings
Exhibit 03: Front-end chip formation steps
Exhibit 04: Back-end chip formation steps
Exhibit 05: Wafer-level manufacturing equipment categories
Exhibit 06: Requirements of a manufacturing equipment
Exhibit 07: Global wafer-level manufacturing equipment market 2015-2020 ($ billions)
Exhibit 08: Five forces analysis
Exhibit 09: Global wafer-level manufacturing equipment market 2015
Exhibit 10: Global wafer fab equipment market 2015-2020 ($ billions)
Exhibit 11: Global wafer-level packaging and assembly equipment market 2015-2020 ($ billions)
Exhibit 12: Global wafer-level manufacturing equipment market by end-user 2015
Exhibit 13: Global wafer-level manufacturing equipment market by end-user 2015-2020
Exhibit 14: Global wafer-level manufacturing equipment market by end-user 2015-2020 ($ billions)
Exhibit 15: Global wafer-level manufacturing equipment market 2015
Exhibit 16: Global wafer-level manufacturing equipment market 2015-2020
Exhibit 17: Global wafer-level manufacturing equipment market 2015-2020 ($ billions)
Exhibit 18: Impact of drivers on key customer segments
Exhibit 19: Global MEMS market 2015-2020 ($ billions)
Exhibit 20: Global semiconductor market trend 1992-2014 ($ billions)
Exhibit 21: Impact of drivers and challenges
Exhibit 22: Timeline for semiconductor wafer size advancements
Exhibit 23: Cars shipment 2015-2020
Exhibit 24: Global wafer-level manufacturing equipment market by vendor 2014
Exhibit 25: ASML customers by end-user segment
Exhibit 26: Applied Materials: Business segmentation by revenue 2014
Exhibit 27: Applied Materials: Business segmentation by revenue 2013 and 2014 ($ billions)
Exhibit 28: Applied Materials: Geographical segmentation by revenue 2014
Exhibit 29: ASML: Product segmentation
Exhibit 30: ASML: Geographical segmentation by revenue 2014
Exhibit 31: KLA-Tencor: Business segmentation by revenue 2014
Exhibit 32: KLA-Tencor: Business segmentation by revenue 2013 and 2014 ($ billions)
Exhibit 33: KLA-Tencor: Geographical segmentation by revenue 2014
Exhibit 34: Lam Research: Geographical segmentation by revenue 2014
Exhibit 35: Lam research: Semiconductor production equipment market in South Korea and Taiwan 2013 and 2014 revenue comparison ($ billions)
Exhibit 36: Tokyo Electron: Business segmentation by revenue 2015
Exhibit 37: Tokyo Electron: Business segmentation by revenue 2014 and 2015 ($ billions)
Exhibit 38: Tokyo Electron: Geographical segmentation by revenue 2015
