TechNavio's analysts forecast the Global Wafer Level Packaging Inspection Systems market to grow at a CAGR of 1.54 percent over the period 2013-2018. One of the key factors contributing to this market growth is the rising demand for smartphones and tablets. The Global Wafer Level Packaging Inspection Systems market has also been witnessing the short replacement cycle of portable electronic devices. However, the cyclical nature of the Semiconductor industry could pose a challenge to the growth of this market.
TechNavio's report, the Global Wafer Level Packaging Inspection Systems Market 2014-2018, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the APAC region, North America, Europe, and the ROW; it also covers the Global Wafer Level Packaging Inspection Systems market landscape and its growth prospects in the coming years. The report also includes a discussion of the key vendors operating in this market.
Key vendors dominating this space are Camtek Ltd., KLA-Tencor Corp., Rudolph Technologies Inc., and Topcon Technohouse Corp.
Other vendors mentioned in the report are Dainippon Screen Manufacturing Co. Ltd., GlobalFoundries Inc., Hitachi Ltd., Intel Corp., Nidec Tosok Corp., Samsung Semiconductor Inc., Semiconductor Manufacturing International Corp., Taiwan Semiconductor Manufacturing Co. Ltd., Toray Engineering Co. Ltd., and United Microelectronics Corp.
Key questions answered in this report:
What will the market size be in 2018 and what will the growth rate be?
What are the key market trends?
What is driving this market?
What are the challenges to market growth?
Who are the key vendors in this market space?
What are the market opportunities and threats faced by the key vendors?
What are the strengths and weaknesses of the key vendors?
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