Wafer Level Packaging Market by Integration Type (Fan-in WLP and Fan-out WLP), Packaging Technology (3D TSV WLP, 2.5D TSV WLP, WLCSP, Nano WLP, and Others), Bumping Technology (Copper Pillar, Solder Bumping, Gold Bumping, and Others), Industry Vertical (Electronics, IT & Telecommunication, Industrial, Automotive, Aerospace & Defense, Healthcare, and Others) - Global Opportunity Analysis and Industry Forecast, 2014-2022

Wafer Level Packaging Market by Integration Type (Fan-in WLP and Fan-out WLP), Packaging Technology (3D TSV WLP, 2.5D TSV WLP, WLCSP, Nano WLP, and Ot

Category : Semiconductor and Electronics
Published On : September  2016
Pages : 214



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Wafer level packaging (WLP) is a technology of packaging an integrated circuit where most or all of the packaging process steps are carried out at the wafer level in contrast to the conventional chip scale packaging and wire bonding. The advancements in wafer level packaging deliver highly efficient and reliable electrical interconnect solutions for electronic products. The market holds a great potential in electronics and IT & telecommunication industries. The leading electronic companies like Samsung, Intel and Apple incorporate these packages in their products. For instance, Apple is going to incorporate wafer level fan-out package for their next generation-iPhone 7. Therefore, the increased adoption of advance packaging technology in portable electronics is expected to propel the demand of wafer level packaging in the years to come.

Roadmap for advancements in packaging technology

Wafer level packaging is a cost-effective technology with technological improvements such as lower form factor, smaller thickness, lower pitches, high density of I/O counts, lower power consumption, and higher package density, which makes it an excellent packaging technology for high end electronic gadgets. It is extensively used in portable electronic devices as it enhances the performance and durability of the device, for instance, iPhone 5 has at least 11 different WLPs, the Samsung Galaxy S3 has 6 WLPs and the HTC One X has 7. Continuous research & development activities to develop innovative and improved packaging technology, are in progress which will lead to the growth of the market.

The growing demand of wafer level packaging technology in industries such as electronics, IT & telecommunication and automotive among others would help in the growth of the wafer level packaging market. WLP enables high functionality with least cost when dealing with complex integrated circuits (IC) with a high number of input/output connections to the outside world. However, strong transmission of mechanical stress between package & board as compared to other package technologies and difficulty in repair due to restricted visual inspection hinders the growth of the market.

Wafer level packaging market is driven by trending Internet of Things (IoT), technological superiority over traditional packaging techniques and impending need of circuit miniaturization in microelectronic devices. In addition, encapsulation being a challenge for fan-out wafer level packaging and high initial investment, functions as key constraints to the market.

The market is segmented on the basis of integration type, packaging technology, bumping technology, industry vertical, and geography. Based on integration type, it is divided into fan-in WLP and fan-out WLP. The market by packaging technology comprises 3D TSV WLP, 2.5D TSV WLP, WLCSP, Nano WLP and others. Based on bumping technology, it is segmented into copper pillar, solder bumping, gold bumping, and others. The market by industry vertical comprises of electronics, IT & telecommunication, industrial, automotive, aerospace & defense, healthcare, and others. Further, the market is analyzed on the basis of regions such as North America, Europe, Asia-Pacific, and LAMEA.

Key players profiled in this report are Amkor Technology Inc., Fujitsu Ltd., Jiangsu Changjiang Electronics Technology Co. Ltd., Deca Technologies, Qualcomm Inc., Toshiba Corp., Tokyo Electron Ltd., Applied Materials, Inc., ASML Holding NV, and Lam Research Corp. among others.

POTENTIAL BENEFITS FOR STAKEHOLDERS:

  • This report provides an in-depth analysis of the world wafer level packaging market and offers current and future trends to identify lucrative investment pockets
  • This report identifies the key drivers, opportunities, and restraints that shape the market and provides an impact analysis for the forecast period
  • Porter’s Five Forces analysis highlights the potency of buyers and suppliers that participate in this market. This would further offer a competitive advantage to stakeholders to make profitable business decisions; thereby, helping them to strengthen their supplier and buyer networks
  • Current and future trends are outlined to determine the overall attractiveness and highlight the profitable trends to gain a stronger foothold
  • Market estimation of geographic segments is derived from the current scenario and expected trends

MARKET SEGMENTATION

The market is segmented on the basis of integration type, packaging technology, bumping technology, industry vertical, and geography.

BY INTEGRATION TYPE

  • Fan-in WLP
  • Fan-out WLP

BY PACKAGING TECHNOLOGY

  • 3D TSV WLP
  • 2.5D TSV WLP
  • WLCSP
  • Nano WLP
  • Others ( 2D TSV WLP and Compliant WLP)

BY BUMPING TECHNOLOGY

  • Copper Pillar
  • Solder Bumping
  • Gold Bumping
  • Others (Aluminum & Conductive Polymer Bumping)

BY INDUSTRY

  • Electronics
  • IT & Telecommunication
  • Industrial
  • Automotive
  • Aerospace & Defense
  • Healthcare
  • Others (Media & Entertainment and Non-Conventional Energy Resources)

BY GEOGRAPHY

  • North America
    • U.S.
    • Canada
    • Mexico
  • Europe
    • Germany
    • UK
    • France
    • Netherland
    • Italy
    • Rest of Europe
  • Asia-Pacific
    • China
    • India
    • Japan
    • South Korea
    • Taiwan
    • Rest of Asia-Pacific
  • LAMEA
    • Latin America
    • Middle East
    • Africa

KEY PLAYERS

  • Amkor Technology Inc.
  • Fujitsu Ltd.
  • Jiangsu Changjiang Electronics Technology Co. Ltd.
  • Deca Technologies
  • Qualcomm Inc.
  • Toshiba Corp.
  • Tokyo Electron Ltd.
  • Applied Materials, Inc.
  • ASML Holding NV
  • Lam Research Corp.

CHAPTER 1 INTRODUCTION

1.1 Report description
1.2 Key benefits
1.3 Key market segments
1.4 Research methodology

1.4.1 Secondary research
1.4.2 Primary research
1.4.3 Analyst tools and models

CHAPTER 2 EXECUTIVE SUMMARY

2.1 CXO perspective

CHAPTER 3 MARKET OVERVIEW

3.1 Market definition and scope
3.2 Key findings

3.2.1 Top factors impacting the market
3.2.2 Top investment pockets
3.2.3 Top winning strategies

3.3 Porters five force analysis

3.3.1 Adequate number of wafer level packaging suppliers leads to low bargaining power of suppliers
3.3.2 Ample number of suppliers leads to high bargaining power of buyers
3.3.3 Market being fully commercialized leads to low threats from the new entrants
3.3.4 Variations in the integration and packaging technology leads to high threats from quality manufacturing techniques by different companies
3.3.5 Profuse competitors lead to high rivalry

3.4 Value chain analysis
3.5 Primary findings
3.6 Market dynamics

3.6.1 Drivers

3.6.1.1 Trending Internet of Things (IoT): a submarket of the overall electronics market
3.6.1.2 Technological superiority over traditional packaging techniques
3.6.1.3 Impending need for circuit miniaturization in microelectronic devices

3.6.2 Restraints

3.6.2.1 High initial investment
3.6.2.2 Encapsulation poses a challenge for fan-out wafer level packaging

3.6.3 Opportunity

3.6.3.1 Thriving demand for small sizes, low cost, and high performance of packaging solutions

CHAPTER 4 WORLD WAFER LEVEL PACKAGING MARKET, BY INTEGRATION TYPE

4.1 Overview
4.2 Fan-in wafer level packaging

4.2.1 Key trends
4.2.2 Key growth factors and opportunities
4.2.3 Market size and forecast

4.3 Fan-out wafer level packaging

4.3.1 Key trends
4.3.2 Key growth factors and opportunities
4.3.3 Market size and forecast

CHAPTER 5 WORLD WAFER LEVEL PACKAGING MARKET, BY PACKAGING TECHNOLOGY

5.1 Overview
5.2 3D TSV WLP

5.2.1 Key trends
5.2.2 Key growth factors and opportunities
5.2.3 Market size and forecast

5.3 2.5D TSV WLP

5.3.1 Key trends
5.3.2 Key growth factors and opportunities
5.3.3 Market size and forecast

5.4 WLCSP

5.4.1 Key trends
5.4.2 Key growth factors and opportunities
5.4.3 Market size and forecast

5.5 Nano WLP

5.5.1 Key trends
5.5.2 Key growth factors and opportunities
5.5.3 Market size and forecast

5.6 Others

5.6.1 Key trends
5.6.2 Key growth factors and opportunities
5.6.3 Market size and forecast

CHAPTER 6 WORLD WAFER LEVEL PACKAGING MARKET, BY BUMPING TECHNOLOGY

6.1 Overview
6.2 Copper pillar

6.2.1 Key trends
6.2.2 Key growth factors and opportunities
6.2.3 Market size and forecast

6.3 Solder bumping

6.3.1 Key trends
6.3.2 Key growth factors and opportunities
6.3.3 Market size and forecast

6.4 Gold bumping

6.4.1 Key trends
6.4.2 Key growth factors and opportunities
6.4.3 Market size and forecast

6.5 Others

6.5.1 Key trends
6.5.2 Key growth factors and opportunities
6.5.3 Market size and forecast

CHAPTER 7 WORLD WAFER LEVEL PACKAGING MARKET, BY INDUSTRY

7.1 Overview
7.2 Electronics

7.2.1 Key trends
7.2.2 Key growth factors and opportunities
7.2.3 Market size and forecast

7.3 IT & Telecommunication

7.3.1 Key trends
7.3.2 Key growth factors and opportunities
7.3.3 Market size and forecast

7.4 Industrial

7.4.1 Key trends
7.4.2 Key growth factors and opportunities
7.4.3 Market size and forecast

7.5 Automotive

7.5.1 Key trends
7.5.2 Key growth factors and opportunities
7.5.3 Market size and forecast

7.6 Aerospace & Defense

7.6.1 Key trends
7.6.2 Key growth factors and opportunities
7.6.3 Market size and forecast

7.7 Healthcare

7.7.1 Key trends
7.7.2 Key growth factors and opportunities
7.7.3 Market size and forecast

7.8 Others

7.8.1 Key trends
7.8.2 Key growth factors and opportunities
7.8.3 Market size and forecast

CHAPTER 8 WORLD WAFER LEVEL PACKAGING MARKET, BY GEOGRAPHY

8.1 Overview
8.2 North America

8.2.1 Key trends
8.2.2 Key growth factors and opportunities
8.2.3 Market size and forecast
8.2.4 U.S.
8.2.5 Canada
8.2.6 Mexico

8.3 Europe

8.3.1 Key trends
8.3.2 Key growth factors and opportunities
8.3.3 Market size and forecast
8.3.4 Germany
8.3.5 UK
8.3.6 Netherland
8.3.7 France
8.3.8 Italy
8.3.9 Rest of Europe

8.4 Asia-Pacific

8.4.1 Key trends
8.4.2 Key growth factors and opportunities
8.4.3 Market size and forecast
8.4.4 China
8.4.5 India
8.4.6 Japan
8.4.7 South Korea
8.4.8 Taiwan
8.4.9 Rest of Asia-Pacific

8.5 LAMEA

8.5.1 Key trends
8.5.2 Key growth factors and opportunities
8.5.3 Market size and forecast
8.5.4 Latin America
8.5.5 Middle East
8.5.6 Africa

CHAPTER 9 COMPANY PROFILES

9.1 Amkor Technology, Inc.

9.1.1 Company overview
9.1.2 Company snapshot
9.1.3 Operating business segments
9.1.4 Business performance
9.1.5 Key strategic moves and developments

9.2 Fujitsu

9.2.1 Company overview
9.2.2 Company snapshot
9.2.3 Operating business segments
9.2.4 Business performance
9.2.5 Key strategic moves and developments

9.3 Jiangsu Changjiang Electronics Technology Co. Ltd.

9.3.1 Company overview
9.3.2 Company snapshot
9.3.3 Operating business segments
9.3.4 Business performance
9.3.5 Key strategic moves and developments

9.4 Deca Technologies

9.4.1 Company overview
9.4.2 Company snapshot
9.4.3 Operating business segments
9.4.4 Business performance
9.4.5 Key strategic moves and developments

9.5 Qualcomm Technologies, Inc.

9.5.1 Company overview
9.5.2 Company snapshot
9.5.3 Operating business segments
9.5.4 Business performance
9.5.5 Key strategic moves and developments

9.6 Toshiba Corporation

9.6.1 Company overview
9.6.2 Company snapshot
9.6.3 Operating business segments
9.6.4 Business performance
9.6.5 Key strategic moves and developments

9.7 Tokyo Electron Ltd.

9.7.1 Company overview
9.7.2 Company snapshot
9.7.3 Operating business segments
9.7.4 Business performance
9.7.5 Key strategic moves and developments

9.8 Applied Materials, Inc.

9.8.1 Company overview
9.8.2 Company snapshot
9.8.3 Operating business segments
9.8.4 Business performance
9.8.5 Key strategic moves and developments

9.9 ASML Holding N.V

9.9.1 Company overview
9.9.2 Company snapshot
9.9.3 Operating business segments
9.9.4 Business performance
9.9.5 Key strategic moves and developments

9.10 Lam Research Corporation

9.10.1 Company overview
9.10.2 Company snapshot
9.10.3 Operating business segments
9.10.4 Business performance
9.10.5 Key strategic moves and developments

LIST OF FIGURES

FIG. 1 ROADMAP FOR ADVANCEMENTS IN PACKAGING TECHNOLOGY
FIG. 2 WORLD WAFER LEVEL PACKAGING MARKET, RESEARCH METHODOLOGY
FIG. 3 WORLD WAFER LEVEL PACKAGING MARKET SEGMENTS, REVENUE & CAGR, 20162022
FIG. 4 WORLD WAFER LEVEL PACKAGING MARKET, COMPARATIVE ANALYSIS, 2015 VS 2022
FIG. 5 FACTORS AND THEIR EXPECTED IMPACT ON WAFER LEVEL PACKAGING MARKET
FIG. 6 TOP IMPACTING FACTORS
FIG. 7 TOP INVESTMENT POCKETS, BY INDUSTRY VERTICAL
FIG. 8 TOP WINNING STRATEGIES
FIG. 9 PORTERS FIVE FORCE ANALYSIS
FIG. 10 VALUE CHAIN ANALYSIS
FIG. 11 DRIVING FACTOR OF WAFER LEVEL PACKAGING MARKET
FIG. 12 COMPARATIVE MARKET SHARE ANALYSIS OF WORLD WAFER LEVEL PACKAGING MARKET, BY INTEGRATION TYPE (% SHARE), 2015 & 2022
FIG. 13 OPPORTUNITIES FOR FIWLP IN MOBILE PHONES
FIG. 14 WORLD FAN IN WAFER LEVEL PACKAGING MARKET ANALYSIS ($MILLION), 2015
FIG. 15 COMPARATIVE REGIONAL MARKET SHARE ANALYSIS OF WORLD FAN-IN WAFER LEVEL PACKAGING MARKET (% SHARE), 2015 & 2022
FIG. 16 WORLD FAN-IN WAFER LEVEL PACKAGING MARKET REVENUE ($MILLION), 20142022
FIG. 17 WORLD FAN-IN WAFER LEVEL PACKAGING MARKET SHARE (%), 20152022
FIG. 18 OPPORTUNITIES FOR FOWLP IN MOBILE PHONES
FIG. 19 WORLD FAN OUT WAFER LEVEL PACKAGING MARKET ANALYSIS ($MILLION), 2015
FIG. 20 COMPARATIVE REGIONAL MARKET SHARE ANALYSIS OF WORLD FAN-OUT WAFER LEVEL PACKAGING MARKET (% SHARE), 2015 & 2022
FIG. 21 WORLD FAN-OUT WAFER LEVEL PACKAGING MARKET REVENUE ($MILLION), 20142022
FIG. 22 WORLD FAN-OUT WAFER LEVEL PACKAGING MARKET SHARE (%), 20142022
FIG. 23 2.5D/3D COMMERCIAL ANNOUNCEMENTS
FIG. 24 COMPARATIVE MARKET SHARE ANALYSIS OF WORLD WAFER LEVEL PACKAGING MARKET, BY PACKAGING TECHNOLOGY (% SHARE), 2015 & 2022
FIG. 25 WORLD 3D TSV WAFER LEVEL PACKAGING MARKET ANALYSIS ($MILLION), 2015
FIG. 26 COMPARATIVE REGIONAL MARKET SHARE ANALYSIS OF WORLD 3D TSV WAFER LEVEL PACKAGING MARKET (% SHARE), 2015 & 2022
FIG. 27 WORLD 3D TSV WAFER LEVEL PACKAGING MARKET REVENUE ($MILLION), 20142022
FIG. 28 WORLD 3D TSV WAFER LEVEL PACKAGING MARKET SHARE (%), 20142022
FIG. 29 WORLD 2.5D TSV WAFER LEVEL PACKAGING MARKET ANALYSIS ($MILLION), 2015
FIG. 30 COMPARATIVE REGIONAL MARKET SHARE ANALYSIS OF WORLD 2.5D TSV WAFER LEVEL PACKAGING MARKET (% SHARE), 2015 & 2022
FIG. 31 WORLD 2.5D TSV WAFER LEVEL PACKAGING MARKET REVENUE ($MILLION), 20142022
FIG. 32 WORLD 2.5D TSV WAFER LEVEL PACKAGING MARKET SHARE (%), 20142022
FIG. 33 WLCSP UNIT FORECAST BY END EQUIPMENT TYPE 2010-16
FIG. 34 WORLD WAFER LEVEL CHIP SCALE PACKAGING MARKET ANALYSIS ($MILLION), 2015
FIG. 35 COMPARATIVE REGIONAL MARKET SHARE ANALYSIS OF WORLD WAFER LEVEL CHIP SCALE PACKAGING MARKET (% SHARE), 2015 & 2022
FIG. 36 WORLD WAFER LEVEL CHIP SCALE PACKAGING MARKET REVENUE ($MILLION), 20142022
FIG. 37 WORLD WAFER LEVEL CHIP SCALE PACKAGING MARKET SHARE (%), 20142022
FIG. 38 WAFER LEVEL PACKAGING: CURRENT VS PROPOSED
FIG. 39 WORLD NANO WAFER LEVEL PACKAGING MARKET ANALYSIS ($MILLION), 2015
FIG. 40 COMPARATIVE REGIONAL MARKET SHARE ANALYSIS OF WORLD NANO WAFER LEVEL PACKAGING MARKET (% SHARE), 2015 & 2022
FIG. 41 WORLD NANO WAFER LEVEL PACKAGING MARKET REVENUE ($MILLION), 20142022
FIG. 42 WORLD NANO WAFER LEVEL PACKAGING MARKET SHARE (%), 20142022
FIG. 43 WORLD OTHERS WAFER LEVEL PACKAGING MARKET ANALYSIS ($MILLION), 2015
FIG. 44 COMPARATIVE REGIONAL MARKET SHARE ANALYSIS OF WORLD OTHERS WAFER LEVEL PACKAGING MARKET (% SHARE), 2015 & 2022
FIG. 45 WORLD OTHERS WAFER LEVEL PACKAGING MARKET REVENUE ($MILLION), 20142022
FIG. 46 WORLD OTHERS WAFER LEVEL PACKAGING MARKET SHARE (%), 20142022
FIG. 47 COMPARATIVE MARKET SHARE ANALYSIS OF WORLD WAFER LEVEL PACKAGING MARKET, BY BUMPING TECHNOLOGY (% SHARE), 2015 & 2022
FIG. 48 WORLD WAFER LEVEL PACKAGING COPPER PILLAR MARKET ANALYSIS ($MILLION), 2015
FIG. 49 COMPARATIVE REGIONAL MARKET SHARE ANALYSIS OF WORLD WAFER LEVEL PACKAGING COPPER PILLAR MARKET (% SHARE), 2015 & 2022
FIG. 50 WORLD WAFER LEVEL PACKAGING COPPER PILLAR MARKET REVENUE ($MILLION), 20142022
FIG. 51 WORLD WAFER LEVEL PACKAGING COPPER PILLAR MARKET SHARE (%), 20142022
FIG. 52 WORLD WAFER LEVEL PACKAGING SOLDER BUMPING MARKET ANALYSIS ($MILLION), 2015
FIG. 53 COMPARATIVE REGIONAL MARKET SHARE ANALYSIS OF WORLD WAFER LEVEL PACKAGING SOLDER BUMPING MARKET (% SHARE), 2015 & 2022
FIG. 54 WORLD WAFER LEVEL PACKAGING SOLDER BUMPING MARKET REVENUE ($MILLION), 20142022
FIG. 55 WORLD WAFER LEVEL PACKAGING SOLDER BUMPING MARKET SHARE (%), 20142022
FIG. 56 WORLD WAFER LEVEL PACKAGING GOLD BUMPING MARKET ANALYSIS ($MILLION), 2015
FIG. 57 COMPARATIVE REGIONAL MARKET SHARE ANALYSIS OF WORLD WAFER LEVEL PACKAGING GOLD BUMPING MARKET (% SHARE), 2015 & 2022
FIG. 58 WORLD WAFER LEVEL PACKAGING GOLD BUMPING MARKET REVENUE ($MILLION), 20142022
FIG. 59 WORLD WAFER LEVEL PACKAGING GOLD BUMPING MARKET SHARE (%), 20142022
FIG. 60 WORLD WAFER LEVEL PACKAGING OTHERS MARKET ANALYSIS ($MILLION), 2015
FIG. 61 COMPARATIVE REGIONAL MARKET SHARE ANALYSIS OF WORLD WAFER LEVEL PACKAGING OTHERS MARKET (% SHARE), 2015 & 2022
FIG. 62 WORLD WAFER LEVEL PACKAGING OTHERS MARKET REVENUE ($MILLION), 20142022
FIG. 63 WORLD WAFER LEVEL PACKAGING OTHERS MARKET SHARE (%), 20142022
FIG. 64 COMPARATIVE MARKET SHARE ANALYSIS OF WORLD WAFER LEVEL PACKAGING MARKET, BY INDUSTRY, 2015 & 2022 (% SHARE)
FIG. 65 WORLD WAFER LEVEL PACKAGING ELECTRONICS MARKET ANALYSIS, 2015 ($MILLION)
FIG. 66 COMPARATIVE REGIONAL MARKET SHARE ANALYSIS OF WORLD WAFER LEVEL PACKAGING ELECTRONICS MARKET, 2015 & 2022 (% SHARE)
FIG. 67 WORLD WAFER LEVEL PACKAGING ELECTRONICS MARKET REVENUE, 20142022 ($MILLION)
FIG. 68 WORLD WAFER LEVEL PACKAGING ELECTRONICS MARKET SHARE, 20142022 (%)
FIG. 69 COMPARATIVE REGIONAL MARKET SHARE ANALYSIS OF WORLD WAFER LEVEL PACKAGING TELECOMMUNICATION MARKET, 2015 & 2022 (% SHARE)
FIG. 70 WORLD WAFER LEVEL PACKAGING TELECOMMUNICATION MARKET REVENUE, 20142022 ($MILLION)
FIG. 71 WORLD WAFER LEVEL PACKAGING TELECOMMUNICATION MARKET SHARE, 20142022 (%)
FIG. 72 COMPARATIVE REGIONAL MARKET SHARE ANALYSIS OF WORLD WAFER LEVEL PACKAGING INDUSTRIAL MARKET, 2015 & 2022 (% SHARE)
FIG. 73 WORLD WAFER LEVEL PACKAGING INDUSTRIAL MARKET REVENUE, 20142022 ($MILLION)
FIG. 74 WORLD WAFER LEVEL PACKAGING INDUSTRIAL MARKET SHARE, 20142022 (%)
FIG. 75 COMPARATIVE REGIONAL MARKET SHARE ANALYSIS OF WORLD WAFER LEVEL PACKAGING AUTOMOTIVE MARKET, 2014 & 2022 (% SHARE)
FIG. 76 WORLD WAFER LEVEL PACKAGING AUTOMOTIVE MARKET REVENUE, 20142022 ($MILLION)
FIG. 77 WORLD WAFER LEVEL PACKAGING AUTOMOTIVE MARKET SHARE, 20142022 (%)
FIG. 78 COMPARATIVE REGIONAL MARKET SHARE ANALYSIS OF WORLD WAFER LEVEL PACKAGING AEROSPACE & DEFENCE MARKET, 2015 & 2022 (% SHARE)
FIG. 79 WORLD WAFER LEVEL PACKAGING AEROSPACE & DEFENSE MARKET REVENUE, 20142022 ($MILLION)
FIG. 80 WORLD WAFER LEVEL PACKAGING AEROSPACE & DEFENSE MARKET SHARE, 20142022 (%)
FIG. 81 COMPARATIVE REGIONAL MARKET SHARE ANALYSIS OF WORLD WAFER LEVEL PACKAGING HEALTHCARE MARKET, 2015 & 2022 (% SHARE)
FIG. 82 WORLD WAFER LEVEL PACKAGING HEALTHCARE MARKET REVENUE, 20142022 ($MILLION)
FIG. 83 WORLD WAFER LEVEL PACKAGING HEALTHCARE MARKET SHARE, 20142022 (%)
FIG. 84 COMPARATIVE REGIONAL MARKET SHARE ANALYSIS OF WORLD WAFER LEVEL PACKAGING OTHERS MARKET, 2015 & 2022 (% SHARE)
FIG. 85 WORLD WAFER LEVEL PACKAGING OTHERS MARKET REVENUE, 20142022 ($MILLION)
FIG. 86 WORLD WAFER LEVEL PACKAGING OTHERS MARKET SHARE, 20142022 (%)
FIG. 87 COMPARATIVE WAFER LEVEL PACKAGING MARKET SHARE ANALYSIS, BY GEOGRAPHY (%), 2015 & 2022
FIG. 88 NORTH AMERICA: WORLD WAFER LEVEL PACKAGING MARKET ANALYSIS, 2015 ($MILLION)
FIG. 89 COMPARATIVE WAFER LEVEL PACKAGING MARKET SHARE ANALYSIS OF NORTH AMERICAN MARKET, BY PACKAGING TECHNOLOGY, 2015 & 2022 (%)
FIG. 90 NORTH AMERICA: WAFER LEVEL PACKAGING MARKET, 20142022 ($MILLION)
FIG. 91 NORTH AMERICA: WAFER LEVEL PACKAGING MARKET, BY PACKAGING TECHNOLOGY, 20142022 (%)
FIG. 92 U.S.: WAFER LEVEL PACKAGING MARKET, 20142022 ($MILLION)
FIG. 93 CANADA: WAFER LEVEL PACKAGING MARKET, 20142022 ($MILLION)
FIG. 94 MEXICO: WAFER LEVEL PACKAGING MARKET, 20142022 ($MILLION)
FIG. 95 EUROPE: WORLD WAFER LEVEL PACKAGING MARKET ANALYSIS, 2015 ($MILLION)
FIG. 96 COMPARATIVE WAFER LEVEL PACKAGING MARKET SHARE ANALYSIS OF EUROPE MARKET, BY PACKAGING TECHNOLOGY, 2015 & 2022 (%)
FIG. 97 EUROPE: WAFER LEVEL PACKAGING MARKET, 20142022 ($MILLION)
FIG. 98 EUROPE: WAFER LEVEL PACKAGING MARKET, BY PACKAGING TECHNOLOGY, 20142022 (%)
FIG. 99 GERMANY: WAFER LEVEL PACKAGING MARKET, 20142022 ($MILLION)
FIG. 100 UK: WAFER LEVEL PACKAGING MARKET, 20142022 ($MILLION)
FIG. 101 NETHERLAND: WAFER LEVEL PACKAGING MARKET, 20142022 ($MILLION)
FIG. 102 FRANCE: WAFER LEVEL PACKAGING MARKET, 20142022 ($MILLION)
FIG. 103 ITALY: WAFER LEVEL PACKAGING MARKET, 20142022 ($MILLION)
FIG. 104 REST OF EUROPE: WAFER LEVEL PACKAGING MARKET, 20142022 ($MILLION)
FIG. 105 ASIA-PACIFIC: WORLD WAFER LEVEL PACKAGING MARKET ANALYSIS, 2015 ($MILLION)
FIG. 106 COMPARATIVE WAFER LEVEL PACKAGING MARKET SHARE ANALYSIS OF ASIA-PACIFIC MARKET, BY PACKAGING TECHNOLOGY, 2015 & 2022 (%)
FIG. 107 ASIA-PACIFIC: WAFER LEVEL PACKAGING MARKET, 20142022 ($MILLION)
FIG. 108 ASIA-PACIFIC: WAFER LEVEL PACKAGING MARKET, BY PACKAGING TECHNOLOGY, 20142022 (%)
FIG. 109 CHINA: WAFER LEVEL PACKAGING MARKET, 20142022 ($MILLION)
FIG. 110 INDIA: WAFER LEVEL PACKAGING MARKET, 20142022 ($MILLION)
FIG. 111 JAPAN: WAFER LEVEL PACKAGING MARKET, 20142022 ($MILLION)
FIG. 112 SOUTH KOREA: WAFER LEVEL PACKAGING MARKET, 20142022 ($MILLION)
FIG. 113 TAIWAN: WAFER LEVEL PACKAGING MARKET, 20142022 ($MILLION)
FIG. 114 REST OF ASIA-PACIFIC: WAFER LEVEL PACKAGING MARKET, 20142022 ($MILLION)
FIG. 115 LAMEA: WORLD WAFER LEVEL PACKAGING MARKET ANALYSIS, 2015 ($MILLION)
FIG. 116 COMPARATIVE WAFER LEVEL PACKAGING MARKET SHARE ANALYSIS OF LAMEA MARKET, BY PACKAGING TECHNOLOGY, 2015 & 2022 (%)
FIG. 117 LAMEA: WAFER LEVEL PACKAGING MARKET, 20142022 ($MILLION)
FIG. 118 LAMEA: WAFER LEVEL PACKAGING MARKET, BY PACKAGING TECHNOLOGY, 20142022 (%)
FIG. 119 LATIN AMERICA: WAFER LEVEL PACKAGING MARKET, 20142022 ($MILLION)
FIG. 120 MIDDLE EAST: WAFER LEVEL PACKAGING MARKET, 20142022 ($MILLION)
FIG. 121 AFRICA: WAFER LEVEL PACKAGING MARKET, 20142022 ($MILLION)
FIG. 122 AMKOR TECHNOLOGY: REVENUE, 20132015 ($MILLION)
FIG. 123 AMKOR TECHNOLOGY: REVENUE BY SEGMENT, 2015 (%)
FIG. 124 AMKOR TECHNOLOGY: REVENUE BY REGION, 2015 (%)
FIG. 125 FUJITSU, REVENUE, 20132015 ($MILLION)
FIG. 126 FUJITSU, REVENUE, BY SEGMENT (%), 2015
FIG. 127 FUJITSU, REVENUE, BY REGION (%), 2015
FIG. 128 JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY: REVENUE, 20132015 ($MILLION)
FIG. 129 JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY: REVENUE BY SEGMENT, 2015 (%)
FIG. 130 JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY: REVENUE BY REGION, 2015 (%)
FIG. 131 DECA TECHNOLOGIES: REVENUE, 20132015 ($MILLION)
FIG. 132 DECA TECHNOLOGIES: REVENUE BY SEGMENT, 2015 (%)
FIG. 133 DECA TECHNOLOGIES: REVENUE BY REGION, 2015 (%)
FIG. 134 QUALCOMM TECHNOLOGIES: REVENUE, 20132015 ($MILLION)
FIG. 135 QUALCOMM TECHNOLOGIES: REVENUE BY SEGMENT, 2015 (%)
FIG. 136 QUALCOMM TECHNOLOGIES: REVENUE BY REGION, 2015 (%)
FIG. 137 TOSHIBA CORPORATION: NET SALES, 20132015 ($MILLION)
FIG. 138 TOSHIBA CORPORATION: REVENUE BY SEGMENT, 2015 (%)
FIG. 139 TOSHIBA CORPORATION: REVENUE BY REGION, 2015 (%)
FIG. 140 TOKYO ELECTRON: REVENUE, 20142016 ($MILLION)
FIG. 141 TOKYO ELECTRON: REVENUE BY SEGMENT, 2016 (%)
FIG. 142 TOKYO ELECTRON: REVENUE BY REGION, 2016 (%)
FIG. 143 APPLIED MATERIALS: REVENUE, 20132015 ($MILLION)
FIG. 144 APPLIED MATERIALS: REVENUE BY SEGMENT, 2015 (%)
FIG. 145 APPLIED MATERIALS: REVENUE BY REGION, 2015 (%)
FIG. 146 ASML: REVENUE, 20132015 ($MILLION)
FIG. 147 ASML: REVENUE BY SEGMENT, 2015 (%)
FIG. 148 ASML: REVENUE BY REGION, 2015 (%)
FIG. 149 LAM RESEARCH: REVENUE, 20142016 ($MILLION)
FIG. 150 LAM RESEARCH: REVENUE BY SEGMENT, 2015 (%)
FIG. 151 LAM RESEARCH: REVENUE BY REGION, 2015 (%)

LIST OF TABLES

TABLE 1 WORLD WAFER LEVEL PACKAGING MARKET, BY INTEGRATION TYPE ($MILLION), 20142022
TABLE 2 WORLD FAN-IN WAFER LEVEL PACKAGING MARKET, BY GEOGRAPHY ($MILLION), 20142022
TABLE 3 WORLD FAN-OUT WAFER LEVEL PACKAGING MARKET, BY GEOGRAPHY ($MILLION), 20142022
TABLE 4 WORLD FLIP CHIP MARKET, BY PACKAGING TECHNOLOGY ($MILLION), 20142022
TABLE 5 WORLD 3D TSV WAFER LEVEL PACKAGING MARKET, BY GEOGRAPHY ($MILLION), 20142022
TABLE 6 WORLD 2.5D TSV WAFER LEVEL PACKAGING MARKET, BY GEOGRAPHY ($MILLION), 20142022
TABLE 7 WORLD WAFER LEVEL CHIP SCALE PACKAGING MARKET, BY GEOGRAPHY ($MILLION), 20142022
TABLE 8 WORLD NANO WAFER LEVEL PACKAGING MARKET, BY GEOGRAPHY ($MILLION), 20142022
TABLE 9 WORLD OTHERS WAFER LEVEL PACKAGING MARKET, BY GEOGRAPHY ($MILLION), 20142022
TABLE 10 WORLD WAFER LEVEL PACKAGING MARKET, BY BUMPING TECHNOLOGY ($MILLION), 20142022
TABLE 11 WORLD WAFER LEVEL PACKAGING COPPER PILLAR MARKET, BY GEOGRAPHY ($MILLION), 20142022
TABLE 12 WORLD WAFER LEVEL PACKAGING SOLDER BUMPING MARKET, BY GEOGRAPHY ($MILLION), 20142022
TABLE 13 WORLD WAFER LEVEL PACKAGING GOLD BUMPING MARKET, BY GEOGRAPHY ($MILLION), 20142022
TABLE 14 WORLD WAFER LEVEL PACKAGING OTHERS MARKET, BY GEOGRAPHY ($MILLION), 20142022
TABLE 15 WORLD WAFER LEVEL PACKAGING MARKET, BY INDUSTRY, 20142022 ($MILLION)
TABLE 16 WORLD WAFER LEVEL PACKAGING ELECTRONICS MARKET, BY GEOGRAPHY, 20142022 ($MILLION)
TABLE 17 WORLD WAFER LEVEL PACKAGING TELECOMMUNICATION MARKET, BY GEOGRAPHY, 20142022 ($MILLION)
TABLE 18 WORLD WAFER LEVEL PACKAGING INDUSTRIAL MARKET, BY GEOGRAPHY, 20142022 ($MILLION)
TABLE 19 WORLD WAFER LEVEL PACKAGING AUTOMOTIVE MARKET, BY GEOGRAPHY, 20142022 ($MILLION)
TABLE 20 WORLD WAFER LEVEL PACKAGING AEROSPACE & DEFENCE MARKET, BY GEOGRAPHY, 20142022 ($MILLION)
TABLE 21 WORLD WAFER LEVEL PACKAGING HEALTHCARE MARKET, BY GEOGRAPHY, 20142022 ($MILLION)
TABLE 22 WORLD WAFER LEVEL PACKAGING OTHERS MARKET, BY GEOGRAPHY, 20142022 ($MILLION)
TABLE 23 NORTH AMERICA: WAFER LEVEL PACKAGING MARKET, BY PACKAGING TECHNOLOGY, 20142022 ($MILLION)
TABLE 24 NORTH AMERICA: WAFER LEVEL PACKAGING MARKET, BY COUNTRY, 20142022 ($MILLION)
TABLE 25 EUROPE: WAFER LEVEL PACKAGING MARKET, BY PACKAGING TECHNOLOGY, 20142022 ($MILLION)
TABLE 26 EUROPE: WAFER LEVEL PACKAGING MARKET, BY COUNTRY, 20142022 ($MILLION)
TABLE 27 ASIA-PACIFIC: WAFER LEVEL PACKAGING MARKET, BY PACKAGING TECHNOLOGY, 20142022 ($MILLION)
TABLE 28 ASIA-PACIFIC: WAFER LEVEL PACKAGING MARKET, BY COUNTRY, 20142022 ($MILLION)
TABLE 29 LAMEA: WAFER LEVEL PACKAGING MARKET, BY PACKAGING TECHNOLOGY, 20142022 ($MILLION)
TABLE 30 LAMEA: WAFER LEVEL PACKAGING MARKET, BY COUNTRY, 20142022 ($MILLION)
TABLE 31 AMKOR TECHNOLOGY - COMPANY SNAPSHOT
TABLE 32 AMKOR TECHNOLOGY COMPANY OPERATING BUSINESS SEGMENTS
TABLE 33 FUJITSU: COMPANY SNAPSHOT
TABLE 34 FUJITSU - OPERATING SEGMENTS
TABLE 35 JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY - COMPANY SNAPSHOT
TABLE 36 JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY COMPANY OPERATING BUSINESS SEGMENTS
TABLE 37 DECA TECHNOLOGIES - COMPANY SNAPSHOT
TABLE 38 DECA TECHNOLOGIES COMPANY OPERATING BUSINESS SEGMENTS
TABLE 39 QUALCOMM TECHNOLOGIES - COMPANY SNAPSHOT
TABLE 40 QUALCOMM TECHNOLOGIES COMPANY OPERATING BUSINESS SEGMENTS
TABLE 41 TOSHIBA CORPORATION - COMPANY SNAPSHOT
TABLE 42 TOSHIBA CORPORATION COMPANY OPERATING BUSINESS SEGMENTS
TABLE 43 TOKYO ELECTRON - COMPANY SNAPSHOT
TABLE 44 TOKYO ELECTRON COMPANY OPERATING BUSINESS SEGMENTS
TABLE 45 APPLIED MATERIALS - COMPANY SNAPSHOT
TABLE 46 APPLIED MATERIALS COMPANY OPERATING BUSINESS SEGMENTS
TABLE 47 ASML - COMPANY SNAPSHOT
TABLE 48 ASML COMPANY OPERATING BUSINESS SEGMENTS
TABLE 49 LAM RESEARCH - COMPANY SNAPSHOT
TABLE 50 LAM RESEARCH COMPANY OPERATING BUSINESS SEGMENTS

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