About CMP Equipment
CMP is a process technology used in the fabrication of wafers. It is a critical step as the process is used to create a flat, polished surface of the wafer. CMP is a nano-polishing process that integrates a continuous a chemical action along with a mechanical action to make the wafer surface flat and smooth at an atomic level. After planarizing a wafer surface, the subsequent steps of photolithography patterning and material deposition occur with a greater accuracy. This results in the formation of uniform film layers with minimum thickness. The polishing process removes any unwanted conductive or dielectric materials from the wafer surface.
Technavio’s analysts forecast the global CMP equipment market to grow at a CAGR of 6.71% during the period 2017-2021.
Covered in this report
The report covers the present scenario and the growth prospects of the global CMP equipment market for 2017-2021. To calculate the market size, the report considers the sales of CMP equipment for polishing 150mm, 200mm, and 300mm wafers. The report does not consider 100mm wafers.
The market is divided into the following segments based on geography:
• Americas
• APAC
• EMEA
Technavio's report, Global CMP Equipment Market 2017-2021, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.
Key vendors
• Applied Materials
• EBARA
• Lapmaster
• LOGITECH
Other prominent vendors
• Entrepix
• Revasum
• TOKYO SEIMITSU
Market driver
• Rising number of fabs
• For a full, detailed list, view our report
Market challenge
• High development costs
• For a full, detailed list, view our report
Market trend
• Use of NEMS
• For a full, detailed list, view our report
Key questions answered in this report
• What will the market size be in 2021 and what will the growth rate be?
• What are the key market trends?
• What is driving this market?
• What are the challenges to market growth?
• Who are the key vendors in this market space?
You can request one free hour of our analyst’s time when you purchase this market report. Details are provided within the report.
Table of Contents
PART 01: Executive summary
PART 02: Scope of the report
PART 03: Research Methodology
PART 04: Introduction
• Market outline
PART 05: Market landscape
• Market overview
• Market size and forecast
• Five forces analysis
PART 06: Market segmentation by wafer size
• Market overview
• Global CMP equipment market by 300mm wafers
• Global CMP equipment market by 200mm wafers
• Global CMP equipment market by 150mm wafers
PART 07: Market segmentation by end-user
• Market overview
• Global CMP equipment market pureplay foundries
• Global CMP equipment market by IDMs
PART 08: Geographical segmentation
• Market overview
• CMP equipment market in APAC
• CMP equipment market in Americas
• CMP equipment market in EMEA
PART 09: Key leading countries
• Taiwan
• China
PART 10: Decision framework
PART 11: Drivers and challenges
• Market drivers
• Market challenges
PART 12: Market trends
• Use of NEMS
• Growth of ULSI
• Transition from planar to 3D structures
• Increasing size of wafers
PART 13: Vendor landscape
• Competitive scenario
PART 14: Key vendor analysis
• Applied Materials
• EBARA
• Lapmaster
• LOGITECH
• Other prominent vendors
PART 15: Appendix
• List of abbreviations
List of Exhibits
Exhibit 01: Global CMP equipment market overview
Exhibit 02: Global CMP equipment market 2016-2021 ($ millions)
Exhibit 03: Global semiconductor foundry market 2016-2021 ($ billions)
Exhibit 04: Global count of 200mm wafer fabs 2016-2021
Exhibit 05: Five forces analysis
Exhibit 06: Global CMP equipment market by wafer size 2016 (% revenue share)
Exhibit 07: Global CMP equipment market by wafer size 2016-2021 ($ millions)
Exhibit 08: Global CMP equipment market by 300mm wafers 2016-2021 ($ millions)
Exhibit 09: Global CMP equipment market by 200mm wafers 2016-2021 ($ millions)
Exhibit 10: Global CMP equipment market by 150mm wafers 2016-2021 ($ millions)
Exhibit 11: Global CMP equipment market by end-user 2016 (% revenue share)
Exhibit 12: Global CMP equipment market by end-user 2016-2021 ($ millions)
Exhibit 13: Global CMP equipment market by pureplay foundries 2016-2021 ($ millions)
Exhibit 14: Global CMP equipment market by IDMs 2016-2021 ($ millions)
Exhibit 15: Global memory market 2016-2021 ($ billions)
Exhibit 16: Global CMP equipment market by geography 2016 (% revenue share)
Exhibit 17: Global CMP equipment market by geography 2016-2021 ($ millions)
Exhibit 18: CMP equipment market in APAC 2016-2021 ($ millions)
Exhibit 19: Major semiconductor foundries in APAC
Exhibit 20: Mobile computing devices market in APAC 2016-2021 ($ millions)
Exhibit 21: CMP equipment market in Americas 2016-2021 ($ millions)
Exhibit 22: CMP equipment market in EMEA 2016-2021 ($ millions)
Exhibit 23: Major foundries in EMEA
Exhibit 24: Key leading countries
Exhibit 25: Global FinFET technology market 2016-2021 ($ millions)
Exhibit 26: Global smartphone market 2016-2021 (millions of units)
Exhibit 27: Global smartwatch market 2016-2021 (millions of units)
Exhibit 28: Timeline of wafer sizes
Exhibit 29: Other prominent vendors
