About Semiconductor Chip Packaging
The growth in the applications of semiconductor chips in industries such as the power, energy, medical, electric vehicles, automobiles, networking and telecommunications, consumer applications, military, aerospace and defense, motor control applications, and robotics is driving the market. Thus, the market for packaging equipment is expected to gain substantial ground during the forecast period, as packaged chips are used to improve functionality and performance of the devices in which they are applied.
Technavio’s analysts forecast the global semiconductor chip packaging market to grow at a CAGR of 31.1% during the period 2017-2021.
Covered in this report
The report covers the present scenario and the growth prospects of the global semiconductor chip packaging market for 2017-2021. To calculate the market size, the report considers the revenue generated from semiconductor chip packaging.
The market is divided into the following segments based on geography:
• Americas
• APAC
• EMEA
Technavio's report, Global Semiconductor Chip Packaging Market 2017-2021, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.
Key vendors
• Applied Materials
• ASM Pacific Technology
• Kulicke & Soffa Industries
• TEL
• Tokyo Seimitsu
Market driver
• Growing number of fabs
• For a full, detailed list, view our report
Market challenge
• Increasing complexity of semiconductor IC designs
• For a full, detailed list, view our report
Market trend
• Development of 3D chip packaging
• For a full, detailed list, view our report
Key questions answered in this report
• What will the market size be in 2021 and what will the growth rate be?
• What are the key market trends?
• What is driving this market?
• What are the challenges to market growth?
• Who are the key vendors in this market space?
• What are the market opportunities and threats faced by the key vendors?
• What are the strengths and weaknesses of the key vendors?
You can request one free hour of our analyst’s time when you purchase this market report. Details are provided within the report.
Table of Contents
PART 01: Executive summary
PART 02: Scope of the report
• Market overview
• Base year
• Market reportage
• Geographical coverage
• Vendor segmentation
• Common currency conversion rates
• Top-vendor offerings
PART 03: Market research methodology
• Research methodology
• Economic indicators
PART 04: Introduction
• Key market highlights
PART 05: Technology landscape
• Semiconductor IC manufacturing process
• WLP versus die-level packaging and assembly
• Roadmap of semiconductor packaging industry
• Ecosystem of semiconductor IC packaging industry
PART 06: Market landscape
• Market overview
• Market size and forecast
• Five forces analysis
PART 07: Market segmentation by OSATs and IDMs
• Global semiconductor chip packaging market by OSATs and IDMs
• OSATs
• IDMs
PART 08: Market segmentation by packaging techniques
• Flip-chip wafer bumping
• 2.5D interposers
• Fan-in WL CSP
• 3D WLP
• FO WLP/SiP
• 3D IC TSV stacks
PART 09: Geographical segmentation
• Market overview
• APAC
• Americas
• EMEA
PART 10: Key leading countries
• USA
• Taiwan
PART 11: Market drivers
• Growing number of fabs
• Increase in miniaturization of electronic devices
• High adoption of semiconductor ICs in automobiles
• Increase in number of fabless semiconductor companies
PART 12: Impact of drivers
PART 13: Market challenges
• High initial investment
• Increasing complexity of semiconductor IC designs
• Rapid technological changes
PART 14: Impact of drivers and challenges
PART 15: Market trends
• Development of 3D chip packaging
• Growing popularity of FOWLP technology
• Increase in wafer size
PART 16: Vendor landscape
• Competitive scenario
• Vendor landscape
PART 17: Appendix
• List of abbreviations
PART 18: Explore Technavio
List of Exhibits
Exhibit 01: List of countries in key regions
Exhibit 02: Currency conversions
Exhibit 03: Product offerings
Exhibit 04: Semiconductor IC manufacturing process
Exhibit 05: Front-end chip formation steps
Exhibit 06: Back-end chip formation steps
Exhibit 07: Semiconductor packaging industry
Exhibit 08:.5D IC block diagram
Exhibit 09:D IC block diagram
Exhibit 10: Old semiconductor IC packaging industry supply chain
Exhibit 11: New semiconductor IC packaging industry supply chain
Exhibit 12: Global semiconductor chip packaging market segmentation
Exhibit 13: Global semiconductor chip packaging market 2016-2021 ($ billions)
Exhibit 14: Five forces analysis
Exhibit 15: Global semiconductor chip packaging market by OSATs and IDMs2016 (% share)
Exhibit 16: Global semiconductor chip packaging market by end-user 2021 (% share)
Exhibit 17: Global semiconductor chip packaging market segmentation by packaging techniques 2016-2021 (% share)
Exhibit 18: Global semiconductor chip packaging market segmentation by packaging techniques 2016-2021 ($ billions)
Exhibit 19: Global semiconductor chip packaging market for flip-chip wafer bumping 2016-2021 ($ billions)
Exhibit 20: Global semiconductor chip packaging market for 2.5D interposers 2016-2021 ($ billions)
Exhibit 21: Global semiconductor chip packaging market for fan-in WL CSP 2016-2021 ($ billions)
Exhibit 22: Global semiconductor chip packaging market by 3D WLP 2016-2020 ($ billions)
Exhibit 23: Global semiconductor chip packaging market for FO WLP/SiP 2016-2021 ($ billions)
Exhibit 24: Global semiconductor chip packaging market for 3DIC TSV stacks 2016-2021 ($ billions)
Exhibit 25: Global semiconductor chip packaging market by geography 2016-2021 (% share)
Exhibit 26: Global semiconductor chip packaging market by geography 2015-2021 ($ billions)
Exhibit 27: Key leading countries
Exhibit 28: Global semiconductor chip packaging market 2016-2021 (% share)
Exhibit 29: Global MEMS market 2016-2021 ($ billions)
Exhibit 30: Cars shipment growth 2016-2021 (%)
Exhibit 31: Impact of drivers
Exhibit 32: Impact of drivers and challenges
Exhibit 33: Timeline for semiconductor wafer size advances
Exhibit 34: Other vendors in global semiconductor chip packaging market
