About Semiconductor Wafer Polishing and Grinding Equipment
Semiconductors form the building blocks of electronic devices. They are the crucial core of any electronic component. Semiconductor capital spending, essentially, refers to the capital investments by vendors in the semiconductor domain. The entire capital spending market is made up of capital equipment assets and other assets. Other assets include land, building, and other essential infrastructure, except the capital equipment required to create semiconductor manufacturing facilities. Capital spending in the semiconductor industry is estimated to grow significantly from 2017. 2016 was the year of the cyclical trend where investments declined substantially due to the oversupply of semiconductor devices.
Technavio’s analysts forecast the global semiconductor wafer polishing and grinding equipment market to grow at a CAGR of 7.10% during the period 2017-2021.
Covered in this report
The report covers the present scenario and the growth prospects of the global semiconductor wafer polishing and grinding equipment market for 2017-2021. The report presents a detailed picture of the market by way of study, synthesis, and summation of data from multiple sources.
The market is divided into the following segments based on geography:
• Americas
• APAC
• EMEA
Technavio's report, Global Semiconductor Wafer Polishing and Grinding Equipment Market 2017-2021, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.
Key vendors
• Applied Materials
• EBARA
• Lapmaster
• Logitech
Other prominent vendors
• Entrepix
• Revasum
• TOKYO SEIMITSU
• Logomatic
Market driver
• Incentives and discounts for long-term customers
• For a full, detailed list, view our report
Market challenge
• High development costs
• For a full, detailed list, view our report
Market trend
• Use of NEMS
• For a full, detailed list, view our report
Key questions answered in this report
• What will the market size be in 2021 and what will the growth rate be?
• What are the key market trends?
• What is driving this market?
• What are the challenges to market growth?
• Who are the key vendors in this market space?
You can request one free hour of our analyst’s time when you purchase this market report. Details are provided within the report.
Table of Contents
PART 01: EXECUTIVE SUMMARY
PART 02: SCOPE OF THE REPORT
PART 03: RESEARCH METHODOLOGY
PART 04: INTRODUCTION
• Market outline
• Semiconductor value chain
PART 05: MARKET LANDSCAPE
• Market ecosystem
• Market characteristics
• Market segmentation analysis
PART 06: MARKET SIZING
• Market definition
• Market size and forecast 2016-2021
PART 07: FIVE FORCES ANALYSIS
PART 08: MARKET SEGMENTATION BY APPLICATION
• Segmentation by application
• Comparison by application
• 300 mm– Market size and forecast 2016-2021
• 200 mm – Market size and forecast 2016-2021
• 150 mm – Market size and forecast 2016-2021
• Market opportunity by application
PART 09: MARKET SEGMENTATION BY END-USER
• Segmentation by end-user
• Comparison by end-user
• Foundries – Market size and forecast 2016-2021
• Memory manufacturers – Market size and forecast 2016-2021
• IDMs – Market size and forecast 2016-2021
• Market opportunity by end-user
PART 10: REGIONAL LANDSCAPE
• Geographical segmentation
• Regional comparison
• APAC – Market size and forecast 2016-2021
• Americas – Market size and forecast 2016-2021
• EMEA – Market size and forecast 2016-2021
• Key leading countries
• Taiwan
• South Korea
• Japan
• China
• Market opportunity
PART 11: DECISION FRAMEWORK
PART 12: DRIVERS AND CHALLENGES
• Market drivers
• Market challenges
PART 13: MARKET TRENDS
• Use of NEMS
• Growth of ULSI
• Transition toward 3D structures
• Increasing wafer sizes
PART 14: VENDOR LANDSCAPE
• Competitive scenario
PART 15: VENDOR ANALYSIS
• Vendor overview
• Applied Materials
• EBARA
• Lapmaster
• Logitech
• Other prominent vendors
PART 16: APPENDIX
• List of abbreviations
List of Exhibits
Exhibit 01: Semiconductor value chain
Exhibit 02: Description of the semiconductor value chain
Exhibit 03: Parent market
Exhibit 04: Global semiconductor capital equipment market
Exhibit 05: Market characteristics
Exhibit 06: Market segments
Exhibit 07: Market definition - Inclusions and exclusions checklist
Exhibit 08: Global semiconductor wafer polishing and grinding equipment market: Market size and forecast 2016-2021 ($ mn)
Exhibit 09: Global semiconductor wafer polishing and grinding equipment market – Year-over-year growth 2017-2021 (%)
Exhibit 10: Five forces analysis
Exhibit 11: Global semiconductor wafer polishing and grinding equipment market by application: Market share 2016-2021 (%)
Exhibit 12: Comparison by application
Exhibit 13: mm – Market size and forecast 2016-2021 ($ mn)
Exhibit 14: mm – Year-over-year growth 2017-2021 (%)
Exhibit 15: mm – Market size and forecast 2016-2021 ($ mn)
Exhibit 16: mm – Year-over-year growth 2017-2021 (%)
Exhibit 17: mm– Market size and forecast 2016-2021 ($ mn)
Exhibit 18: mm – Year-over-year growth 2017-2021 (%)
Exhibit 19: Market opportunity by application
Exhibit 20: Global semiconductor wafer polishing and grinding equipment market by end-user: Market share 2016-2021 (%)
Exhibit 21: Comparison by end-user
Exhibit 22: Foundries – Market size and forecast 2016-2021 ($ mn)
Exhibit 23: Foundries – Year-over-year growth 2017-2021 (%)
Exhibit 24: Memory manufacturers – Market size and forecast 2016-2021 ($ mn)
Exhibit 25: Global memory market 2016-2021 ($ bn)
Exhibit 26: Memory manufacturers – Year-over-year growth 2017-2021 (%)
Exhibit 27: IDMs – Market size and forecast 2016-2021 ($ mn)
Exhibit 28: IDMs – Year-over-year growth 2017-2021 (%)
Exhibit 29: Market opportunity by end-user
Exhibit 30: Global semiconductor wafer polishing and grinding equipment market – Market share 2016-2021 (%)
Exhibit 31: Regional comparison
Exhibit 32: APAC – Market size and forecast 2016-2021 ($ mn)
Exhibit 33: Major foundries located in APAC
Exhibit 34: APAC – Year-over-year growth 2017-2021 (%)
Exhibit 35: Americas – Market size and forecast 2016-2021 ($ mn)
Exhibit 36: Americas – Year-over-year growth 2017-2021 (%)
Exhibit 37: EMEA – Market size and forecast 2016-2021 ($ mn)
Exhibit 38: EMEA – Year-over-year growth 2017-2021 (%)
Exhibit 39: Key leading countries
Exhibit 40: Global consumer electronic device shipments 2016-2021 (units in billions)
Exhibit 41: Global semiconductor market trend 1990-2016 ($ bn)
Exhibit 42: Timeline of the wafer sizes
Exhibit 43: Other prominent vendors
