About the Semiconductor Capital Equipment Market The semiconductor capital equipment has a bigger role in the making of integrated devices, such as ICs, which are based in a fab. The different types of equipment which come under semiconductor capital equipment include the following: • Wafer manufacturing equipment • ATE • Assembling and packaging equipment • Fab related equipment • Memory testing equipment • Chip handler equipment • Logic test equipment • Prober equipment • Sputter equipment • Thin film deposition equipment Technavio’s analysts forecast the global semiconductor capital equipment market to grow at a CAGR of 4.02% during the period 2016-2020. Covered in this report The report covers the present scenario and the growth prospects of the global semiconductor capital equipment market for 2016-2020. To calculate the market size, the report considers the revenue generated from each equipment of the semiconductor production process. This equipment includes the following: • Wafer-level manufacturing equipment • Die-level packaging and assembly equipment • ATE The market is divided into the following segments based on geography: • APAC • Europe • North America • ROW Technavio's report, Global Semiconductor... Research Beam Model: Research Beam Product ID: 663864 2500 USD New
Global Semiconductor Capital Equipment Market 2016-2020
 
 

Global Semiconductor Capital Equipment Market 2016-2020

  • Category : Semiconductor and Electronics
  • Published On : June   2016
  • Pages : 58
  • Publisher : Technavio
 
 
 
About the Semiconductor Capital Equipment Market

The semiconductor capital equipment has a bigger role in the making of integrated devices, such as ICs, which are based in a fab. The different types of equipment which come under semiconductor capital equipment include the following:
• Wafer manufacturing equipment
• ATE
• Assembling and packaging equipment
• Fab related equipment
• Memory testing equipment
• Chip handler equipment
• Logic test equipment
• Prober equipment
• Sputter equipment
• Thin film deposition equipment

Technavio’s analysts forecast the global semiconductor capital equipment market to grow at a CAGR of 4.02% during the period 2016-2020.

Covered in this report
The report covers the present scenario and the growth prospects of the global semiconductor capital equipment market for 2016-2020. To calculate the market size, the report considers the revenue generated from each equipment of the semiconductor production process. This equipment includes the following:
• Wafer-level manufacturing equipment
• Die-level packaging and assembly equipment
• ATE


The market is divided into the following segments based on geography:
• APAC
• Europe
• North America
• ROW

Technavio's report, Global Semiconductor Capital Equipment Market 2016-2020, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the operating in this market.

Key vendors
• ASML
• Applied Materials
• LAM Research
• Tokyo Electron

Other prominent vendors
• Advantest
• ASM International
• Hitachi High-Technologies
• KLA-Tencor
• Nikon
• Screen Holdings
• Teradyne

Market driver
• Need for high precision tolerance for miniaturized electronic devices
• For a full, detailed list, view our report

Market challenge
• Cyclical nature of the semiconductor industry
• For a full, detailed list, view our report

Market trend
• Increased use of semiconductor devices in automobiles
• For a full, detailed list, view our report

Key questions answered in this report
• What will the market size be in 2020 and what will the growth rate be?
• What are the key market trends?
• What is driving this market?
• What are the challenges to market growth?
• Who are the in this market space?
• What are the market opportunities and threats faced by the key vendors?
• What are the strengths and weaknesses of the key vendors?

You can request one free hour of our analyst’s time when you purchase this market report. Details are provided within the report.


PART 01: Executive summary
• Highlights

PART 02: Scope of the report
• Top-vendor offerings

PART 03: Market research methodology
• Research methodology
• Economic indicators

PART 04: Introduction
• Key market highlights

PART 05: Industry overview
• Semiconductor value chain

PART 06: Market landscape
• Market overview
• Market size and forecast
• Five forces model

PART 07: Market segmentation by equipment type
• Market overview
• Market size and forecast

PART 08: Market segmentation by end user
• Market overview
• Market size and forecast

PART 09: Geographical segmentation
• Market overview
• Market size and forecast

PART 10: Market drivers
• Sustainable growth in global semiconductor industry
• Increase in number of fabs worldwide
• Need for high precision tolerance for miniaturized electronic devices
• Shorter time to market

PART 11: Impact of drivers

PART 12: Market challenges
• Continuous price pressure on the vendors
• Cyclical nature of the semiconductor industry
• Fluctuations in global economy and foreign exchange rates
• Dependency on limited key suppliers

PART 13: Impact of drivers and challenges

PART 14: Market trends
• Rapid technological advances
• Increased use of semiconductor devices in automobiles
• Rise in the number of fabless semiconductor companies

PART 15: Vendor landscape
• Competitive scenario
• Current scenario
• Other prominent vendors

PART 16: Appendix
• Summary of figures
• List of abbreviations

PART 17: Explore Technavio

List of Exhibits
Exhibit 01: Product offerings
Exhibit 02: Semiconductor value chain
Exhibit 03: Description of the processes of the semiconductor value chain
Exhibit 04: Significance of semiconductor equipment buying parameter for the customer segment
Exhibit 05: Global semiconductor capital equipment market segments: An overview
Exhibit 06: Global semiconductor capital equipment market 2015-2020 ($ billions)
Exhibit 07: Five forces model
Exhibit 08: Global semiconductor capital equipment market 2015 by equipment type (% share)
Exhibit 09: Global semiconductor capital equipment market 2020 by equipment type (% share)
Exhibit 10: Global semiconductor capital equipment market 2015-2020 by equipment type ($ billions)
Exhibit 11: Contribution of different wafer-level manufacturing equipment 2015-2020 (% share)
Exhibit 12: Wafer fabrication process steps
Exhibit 13: Global smartphone shipment 2015-2020 (% share)
Exhibit 14: Global semiconductor capital equipment market by end-user 2015 (% share)
Exhibit 15: Global semiconductor capital equipment market by end-user 2015-2020 (% share)
Exhibit 16: Global semiconductor capital equipment market by end-user 2015-2020 ($ billions)
Exhibit 17: Global semiconductor capital equipment market by geography 2015 (% share)
Exhibit 18: Global semiconductor capital equipment market by geography 2015-2020 (% share)
Exhibit 19: Global semiconductor capital equipment market by geography 2015-2020 ($ billions)
Exhibit 20: Key leading countries of APAC
Exhibit 21: CAGR of LED chip, sensor, DRAM, and NAND market 2015-2020
Exhibit 22: Global NAND flash market 2015-2020 (% share)
Exhibit 23: Impact of drivers
Exhibit 24: Global semiconductor market trend 1990-2015 ($ billions)
Exhibit 25: Impact of drivers and challenges
Exhibit 26: Timeline for semiconductor wafer size advances
Exhibit 27: Car shipment 2015-2020
Exhibit 28: Principle parameters of competition
Exhibit 29: R&D spending by prominent vendors in the global semiconductor capital equipment market 2015
Exhibit 30: Global semiconductor capital equipment market share by vendor contribution 2015 (% share)
Exhibit 31: ASML customers by end-user segment
Exhibit 32: Major customers of Lam Research
Exhibit 33: Key vendors
Exhibit 34: Key news
Exhibit 35: Other prominent vendors
Exhibit 36: Summary of figures

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