Embedded Die Packaging Technology Market by Platform (Embedded Die in IC Package Substrate, Embedded Die in Rigid Board, and Embedded Die in Flexible Board) and Industry Vertical (Consumer Electronics, IT & Telecommunications, Automotive, Healthcare, and Others): Global Opportunity Analysis and Industry Forecast, 2017-2023
- Publisher : Allied Market Research
- Date:
June
2017
- Pages :
168
- Pricing : $5370