Global 3D semiconductor packaging market size is expected to garner $8.9 billion by 2022, growing at a CAGR of 15.7% from 2016 to 2022. 3D semiconductor packaging refers to an advanced packaging technology of semiconductor chips in which two or more layers of active electronic components are stacked together and interconnected vertically as well as horizontally to perform as a single device. This technology possesses various advantages over other advanced packaging technologies such as reduced space consumption, decreased power loss, better overall performance, and enhanced efficiency. Research Beam Model: Research Beam Product ID: 994877 5370 USD New
3D Semiconductor Packaging Market by Technology (3D Through silicon via, 3D Package on Package, 3D Fan Out Based, 3D Wire Bonded, and Others), by Material (Organic Substrate, Bonding Wire, Leadframe, Encapsulation Resin, Ceramic Package, Die Attach Material, and Others), and Industry Vertical (Electronics, Industrial, Automotive & Transport, Healthcare, IT & Telecommunication, Aerospace & Defense, and Others) - Global Opportunity Analysis and Industry Forecast, 2014-2022
 

3D Semiconductor Packaging Market by Technology (3D Through silicon via, 3D Package on Package, 3D Fan Out Based, 3D Wire Bonded, and Others), by Material (Organic Substrate, Bonding Wire, Leadframe, Encapsulation Resin, Ceramic Package, Die Attach Material, and Others), and Industry Vertical (Electronics, Industrial, Automotive & Transport, Healthcare, IT & Telecommunication, Aerospace & Defense, and Others) - Global Opportunity Analysis and Industry Forecast, 2014-2022

3D Semiconductor Packaging Market by Technology (3D Through silicon via, 3D Package on Package, 3D Fan Out Based, 3D Wire Bonded, and Others), by Mate

Category : Semiconductor and Electronics
Published On : December  2016
Pages : 220

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Global 3D semiconductor packaging market size is expected to garner $8.9 billion by 2022, growing at a CAGR of 15.7% from 2016 to 2022. 3D semiconductor packaging refers to an advanced packaging technology of semiconductor chips in which two or more layers of active electronic components are stacked together and interconnected vertically as well as horizontally to perform as a single device. This technology possesses various advantages over other advanced packaging technologies such as reduced space consumption, decreased power loss, better overall performance, and enhanced efficiency.

A special feature of 3D packaging design that distinguishes it from other advanced packaging methods is that it mounts the die on top of each other unlike side-by-side mounting of 2D packaging, which consecutively acquires less space, and results in the formation of more compact chips and aids the growing demand for circuit miniaturization. Furthermore, overall less cost of as compared to other advanced packaging technology options gives an edge and fuels its adoption in memory chip stacking, I/O DRAMS, and high bandwidth applications. The need for miniaturization of memory chips, high bandwidth requirements in electronic circuits, and reduced cost than other advanced packaging technologies are prime factors, which foster the demand in 3D packaging industry.

The need to control the chip designing cost, which plays a major role in overall price of electronic devices; increase in demand for miniaturized circuits; and short replacement period of electronics products, which are constituted of integrated circuits manufactured with 3D packaging technology are the major factors that drive the growth in the 3D semiconductor packaging industry. However, high cost required to establish a 3D semiconductor packaging facility hinders the growth opportunities in 3D semiconductor packaging industry and this is anticipated to grow the overall 3D semiconductor packaging market size to three folds of the current value. On the contrary, the growth in trend of Internet of Things (IoT) and increase in number of wireless devices are opening new opportunities which will increase 3D semiconductor packaging market share in overall advanced packaging market. The ongoing 3D semiconductor packaging market trends suggest that the market will witness a double-digit growth in next five to six years.

The global 3D semiconductor packaging market is segmented on the basis of technology, materials, industry vertical, and geography. Based on technology, the 3D semiconductor packaging industry is segmented into 3D through silicon via, 3D package on package, 3D fan out based, 3D wire bonded, and others. By materials, the 3D semiconductor packaging  market is classified into organic substrate, bonding wire, leadframe, encapsulation resin, ceramic package, die attach material, and others Furthermore, the 3D semiconductor packaging industry is categorized on the basis of industry vertical, which includes electronics, industrial, automotive & transport, healthcare, IT & telecommunication, aerospace & defense, and others. Geographically, it is divided into North America, Europe, Asia-Pacific, and LAMEA.

The key players profiled in the report include Amkor Technology, ASE group, Siliconware Precision Industries Co., Ltd., Jiangsu Changjiang Electronics Technology Co. Ltd., SÜSS MicroTec AG., International Business Machines Corporation (IBM), Intel Corporation, Qualcomm Technologies, Inc., STMicroelectronics, and Taiwan Semiconductor Manufacturing Company.

POTENTIAL BENEFITS FOR STAKEHOLDERS:

  • This report provides an in-depth analysis of the global 3D semiconductor packaging market along with current 3D semiconductor packaging market trends and future estimations to identify lucrative investment opportunities
  • This report identifies the key drivers, opportunities, and restraints that shape the market along with their impact analysis
  • Porter’s Five Forces analysis highlights the potency of buyers and suppliers that participate in this market to facilitate better business decisions for stakeholders and strengthen their supplier and buyer networks
  • Market estimation of geographical regions is based on the current market scenario and future trends.

MARKET SEGMENTATION

The market is segmented on the basis of technology, materials, industry vertical, and geography.

BY TECHNOLOGY

  • 3D Through Silicon Via
  • 3D Package on Package
  • 3D Fan Out Based
  • 3D Wire Bonded
  • Others (Flip Chip and Hybrid)

BY MATERIAL

  • Organic Substrate
  • Bonding Wire
  • Leadframe
  • Encapsulation Resins
  • Ceramic Packages
  • Die Attach Material
  • Others (Underfill Materials and Solder Balls)

BY INDUSTRY VERTICAL

  • Electronics
  • Industrial
  • Automotive & Transport
  • Healthcare
  • IT & Telecommunication
  • Aerospace & Defense
  • Others (Media & Entertainment and Renewable Energy Resources)

BY GEOGRAPHY

  • North America
    • U.S.
    • Canada
    • Mexico
  • Europe
    • UK
    • Germany
    • France
    • Italy
    • Rest of Europe
  • Asia-Pacific
    • China
    • Japan
    • Taiwan
    • South Korea
    • India
    • Rest of Asia-Pacific
  • LAMEA
    • Latin America
    • Middle East
    • Africa

KEY PLAYERS

  • Amkor Technology
  • ASE Group
  • Siliconware Precision Industries Co., Ltd.
  • Jiangsu Changjiang Electronics Technology Co. Ltd.
  • SÜSS MicroTec AG.
  • International Business Machines Corporation (IBM)
  • Intel Corporation
  • Qualcomm Technologies, Inc.
  • STMicroelectronics
  • Taiwan Semiconductor Manufacturing Company

Other players in the value chain include (profiles not included in the report)

  • Sony corp.
  • SAMSUNG electronics co. ltd.
  • Advanced Micro Devices, Inc.
  • Cisco

CHAPTER 1 INTRODUCTION

1.1. REPORT DESCRIPTION
1.2. KEY BENEFITS
1.3. KEY MARKET SEGMENTS
1.4. RESEARCH METHODOLOGY

1.4.1. Secondary research
1.4.2. Primary research
1.4.3. Analyst tools and models

CHAPTER 2 EXECUTIVE SUMMARY

2.1. CXO PERSPECTIVE

CHAPTER 3 MARKET OVERVIEW

3.1. MARKET DEFINITION AND SCOPE
3.2. KEY FINDINGS

3.2.1. Top Impacting Factors

3.2.1.1. Increase in number of portable electronic devices
3.2.1.2. Rise in demand for miniaturized circuits in microelectronic devices
3.2.1.3. Technological superiorities over 2D packaging technology
3.2.1.4. High initial capital investment required to set up a plant works as a restraining factor
3.2.1.5. Thermal issues with devices restrains the growth in the market

3.2.2. Top winning strategies
3.2.3. Top investment pockets

3.3. PORTERS FIVE FORCES ANALYSIS

3.3.1. Bargaining power of suppliers
3.3.2. Bargaining power of buyers
3.3.3. Threat of substitutes
3.3.4. Threat of new entrants
3.3.5. Intensity of competitive rivalry

3.4. MARKET SHARE ANALYSIS, 2015
3.5. 3D SEMICONDUCTOR PACKAGING MARKET: VALUE CHAIN ANALYSIS
3.6. MARKET DYNAMICS

3.6.1. Drivers

3.6.1.1. Increase in number of portable electronic devices
3.6.1.2. Rise in demand of miniaturized circuits in microelectronic devices
3.6.1.3. Technological superiorities over 2D packaging technology

3.6.2. Restraint

3.6.2.1. High initial capital investment required to set up a plant
3.6.2.2. Thermal issues with devices

3.6.3. Opportunities

3.6.3.1. Growing trend of Internet of Things (IoT)

CHAPTER 4 GLOBAL 3D SEMICONDUCTOR PACKAGING MARKET, BY TECHNOLOGY

4.1. OVERVIEW

4.1.1. Market size and forecast

4.2. 3D THROUGH SILICON VIA (TSV)

4.2.1. Key market trends
4.2.2. Growth factors and opportunities
4.2.3. Market size and forecast

4.3. 3D PACKAGE ON PACKAGE (POP)

4.3.1. Key market trends
4.3.2. Growth factors and opportunities
4.3.3. Market size and forecast

4.4. 3D FAN OUT

4.4.1. Key market trends
4.4.2. Growth factors and opportunities
4.4.3. Market size and forecast

4.5. 3D WIRE BONDED

4.5.1. Key market trends
4.5.2. Growth factors and opportunities
4.5.3. Market size and forecast

4.6. OTHERS (FLIP CHIP AND HYBRID)

4.6.1. Key market trends
4.6.2. Growth factors and opportunities
4.6.3. Market size and forecast

CHAPTER 5 GLOBAL 3D SEMICONDUCTOR PACKAGING MARKET, BY MATERIAL

5.1. OVERVIEW

5.1.1. Market size and forecast

5.2. ORGANIC SUBSTRATE

5.2.1. Key market trends
5.2.2. Growth factors and opportunities
5.2.3. Market size and forecast

5.3. BONDING WIRE

5.3.1. Key market trends
5.3.2. Growth factors and opportunities
5.3.3. Market size and forecast

5.4. LEADFRAME

5.4.1. Key market trends
5.4.2. Growth factors and opportunities
5.4.3. Market size and forecast

5.5. ENCAPSULATION RESIN

5.5.1. Key market trends
5.5.2. Growth factors and opportunities
5.5.3. Market size and forecast

5.6. CERAMIC PACKAGE

5.6.1. Key market trends
5.6.2. Growth factors and opportunities
5.6.3. Market size and forecast

5.7. DIE ATTACH MATERIAL

5.7.1. Key market trends
5.7.2. Growth factors and opportunities
5.7.3. Market size and forecast

5.8. OTHERS

5.8.1. Key market trends
5.8.2. Growth factors and opportunities
5.8.3. Market size and forecast

CHAPTER 6 GLOBAL 3D SEMICONDUCTOR PACKAGING MARKET, BY INDUSTRY VERTICAL

6.1. OVERVIEW

6.1.1. Market size and forecast

6.2. ELECTRONICS

6.2.1. Key market trends
6.2.2. Growth factors and opportunities
6.2.3. Market size and forecast

6.3. INDUSTRIAL

6.3.1. Key market trends
6.3.2. Growth factors and opportunities
6.3.3. Market size and forecast

6.4. IT & TELECOMMUNICATION

6.4.1. Key market trends
6.4.2. Growth factors and opportunities
6.4.3. Market size and forecast

6.5. HEALTHCARE

6.5.1. Key market trends
6.5.2. Growth factors and opportunities
6.5.3. Market size and forecast

6.6. AUTOMOTIVE & TRANSPORT

6.6.1. Key market trends
6.6.2. Growth factors and opportunities
6.6.3. Market size and forecast

6.7. AEROSPACE & DEFENSE

6.7.1. Key market trends
6.7.2. Growth factors and opportunities
6.7.3. Market size and forecast

6.8. OTHERS (RENEWABLE ENERGY AND MEDIA & ENTERTAINMENT)

6.8.1. Key market trends
6.8.2. Growth factors and opportunities
6.8.3. Market size and forecast

CHAPTER 7 WORLD 3D SEMICONDUCTOR PACKAGING MARKET, BY GEOGRAPHY

7.1. OVERVIEW

7.1.1. Market size and forecast

7.2. NORTH AMERICA

7.2.1. Key market trends
7.2.2. Growth factors and opportunities
7.2.3. Market size and forecast
7.2.4. US

7.2.4.1. Market size and forecast

7.2.5. Canada

7.2.5.1. Market size and forecast

7.2.6. Mexico

7.2.6.1. Market size and forecast

7.3. EUROPE

7.3.1. Key market trends
7.3.2. Growth factors and opportunities
7.3.3. Market size and forecast
7.3.4. UK

7.3.4.1. Market size and forecast

7.3.5. Germany

7.3.5.1. Market size and forecast

7.3.6. France

7.3.6.1. Market size and forecast

7.3.7. Italy

7.3.7.1. Market size and forecast

7.3.8. Rest of Europe

7.3.8.1. Market size and forecast

7.4. ASIA-PACIFIC

7.4.1. Key market trends
7.4.2. Growth factors and opportunities
7.4.3. Market size and forecast
7.4.4. China

7.4.4.1. Market size and forecast

7.4.5. Japan

7.4.5.1. Market size and forecast

7.4.6. South Korea

7.4.6.1. Market size and forecast

7.4.7. India

7.4.7.1. Market size and forecast

7.4.8. Rest of Asia-Pacific

7.4.8.1. Market size and forecast

7.5. LAMEA

7.5.1. Key market trends
7.5.2. Growth factors and opportunities
7.5.3. Market size and forecast
7.5.4. Latin America

7.5.4.1. Market size and forecast

7.5.5. Middle East

7.5.5.1. Market size and forecast

7.5.6. Africa

7.5.6.1. Market size and forecast

CHAPTER 8 COMPANY PROFILES

8.1. AMKOR TECHNOLOGY, INC.

8.1.1. Company overview
8.1.2. Operating business segments
8.1.3. Business performance
8.1.4. Key strategic moves and developments

8.2. JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO., LTD.

8.2.1. Company overview
8.2.2. Operating business segments
8.2.3. Business performance
8.2.4. Key strategic moves and developments

8.3. INTERNATIONAL BUSINESS MACHINES CORPORATION (IBM)

8.3.1. Company overview
8.3.2. Operating business segments
8.3.3. Business performance
8.3.4. Key strategic moves and developments

8.4. QUALCOMM TECHNOLOGIES, INC.

8.4.1. Company overview
8.4.2. Operating business segments
8.4.3. Business performance
8.4.4. Key strategic moves and developments

8.5. INTEL CORPORATION

8.5.1. Company overview
8.5.2. Operating business segments
8.5.3. Business performance
8.5.4. Key strategic moves and developments

8.6. TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.

8.6.1. Company overview
8.6.2. Operating business segments
8.6.3. Business performance
8.6.4. Key strategic moves and developments

8.7. STMICROELECTRONICS N.V.

8.7.1. Company overview
8.7.2. Operating business segments
8.7.3. Business performance
8.7.4. Key strategic moves and developments

8.8. SILICONWARE PRECISION INDUSTRIES CO., LTD. (SPIL)

8.8.1. Company overview
8.8.2. Operating business segments
8.8.3. Business performance
8.8.4. Key strategic moves and developments

8.9. SUSS MICROTEC AG.

8.9.1. Company overview
8.9.2. Operating business segments
8.9.3. Business performance
8.9.4. Key strategic moves and developments

8.10. ASE GROUP

8.10.1. Company overview
8.10.2. Operating business segments
8.10.3. Business performance
8.10.4. Key strategic moves and developments

*Other players in the value chain include:

  • Sony Corp
  • SAMSUNG Electronics Co. Ltd.
  • Advanced Micro Devices, Inc.
  • Cisco

*Profiles of these players are not included. The same will be included on request

LIST OF FIGURES

FIGURE 1. SEGMENTATIONS
FIGURE 2. SMARTPHONE USERS IN MILLION (2014-2019)
FIGURE 3. TOP IMPACTING FACTORS
FIGURE 4. TOP WINNING STRATEGIES: PERCENTAGE DISTRIBUTION (2013 2016)
FIGURE 5. TOP WINNING STRATEGIES: NATURE AND TYPE
FIGURE 6. TOP INVESTMENT POCKETS IN WORLD 3D SEMICONDUCTOR PACKAGING MARKET, BY INDUSTRY VERTICAL
FIGURE 7. PORTERS FIVE FORCES ANALYSIS
FIGURE 8. MARKET SHARE ANALYSIS, 2015
FIGURE 9. 3D SEMICONDUCTOR PACKAGING MARKET: VALUE CHAIN ANALYSIS
FIGURE 10. 3D SEMICONDUCTOR PACKAGING MARKET: VALUE CHAIN ANALYSIS ($MILLION), 2010-2015
FIGURE 11. INCREASE IN NUMBER OF CONNECTED DEVICES ACROSS THE GLOBE (2010-2020)
FIGURE 12. COMPARATIVE REGIONAL MARKET SHARE ANALYSIS OF GLOBAL 3D TSV SEMICONDUCTOR PACKAGING MARKET, 2015 & 2022 (%)
FIGURE 13. MARKET REVENUE & FORECAST OF GLOBAL 3D TSV SEMICONDUCTOR PACKAGING MARKET, 2014-2022 ($MILLION)
FIGURE 14. COMPARATIVE REGIONAL MARKET SHARE ANALYSIS OF GLOBAL 3D POP SEMICONDUCTOR PACKAGING MARKET, 2015 & 2022 (%)
FIGURE 15. MARKET REVENUE & FORECAST OF GLOBAL 3D POP SEMICONDUCTOR PACKAGING MARKET, 2014-2022 ($MILLION)
FIGURE 16. COMPARATIVE REGIONAL MARKET SHARE ANALYSIS OF GLOBAL 3D FAN OUT SEMICONDUCTOR PACKAGING MARKET, 2015 & 2022 (%)
FIGURE 17. MARKET REVENUE & FORECAST OF GLOBAL 3D FAN OUT SEMICONDUCTOR PACKAGING MARKET, 2014-2022 ($MILLION)
FIGURE 18. COMPARATIVE REGIONAL MARKET SHARE ANALYSIS OF GLOBAL 3D WIRE BONDED SEMICONDUCTOR PACKAGING MARKET, 2015 & 2022 (%)
FIGURE 19. MARKET REVENUE & FORECAST OF GLOBAL 3D WIRE BONDED SEMICONDUCTOR PACKAGING MARKET, 2014-2022 ($MILLION)
FIGURE 20. COMPARATIVE REGIONAL MARKET SHARE ANALYSIS OF GLOBAL OTHERS 3D SEMICONDUCTOR PACKAGING MARKET, 2015 & 2022 (%)
FIGURE 21. MARKET REVENUE & FORECAST OF GLOBAL OTHERS 3D SEMICONDUCTOR PACKAGING MARKET, 2014-2022 ($MILLION)
FIGURE 22. COMPARATIVE REGIONAL MARKET SHARE ANALYSIS OF GLOBAL ORGANIC SUBSTRATE 3D SEMICONDUCTOR PACKAGING MARKET, 2015 & 2022 (%)
FIGURE 23. MARKET REVENUE & FORECAST OF GLOBAL ORGANIC SUBSTRATE 3D SEMICONDUCTOR PACKAGING MARKET, 2014-2022 ($MILLION)
FIGURE 24. COMPARATIVE REGIONAL MARKET SHARE ANALYSIS OF GLOBAL BONDING WIRE 3D SEMICONDUCTOR PACKAGING MARKET, 2015 & 2022 (%)
FIGURE 25. MARKET REVENUE & FORECAST OF GLOBAL BONDING WIRE 3D SEMICONDUCTOR PACKAGING MARKET, 2014-2022 ($MILLION)
FIGURE 26. COMPARATIVE REGIONAL MARKET SHARE ANALYSIS OF GLOBAL LEADFRAME 3D SEMICONDUCTOR PACKAGING MARKET, 2015 & 2022 (%)
FIGURE 27. MARKET REVENUE & FORECAST OF GLOBAL LEADFRAME 3D SEMICONDUCTOR PACKAGING MARKET, 2014-2022 ($MILLION)
FIGURE 28. COMPARATIVE REGIONAL MARKET SHARE ANALYSIS OF GLOBAL ENCAPSULATION RESIN 3D SEMICONDUCTOR PACKAGING MARKET, 2015 & 2022 (%)
FIGURE 29. MARKET REVENUE & FORECAST OF GLOBAL ENCAPSULATION RESIN 3D SEMICONDUCTOR PACKAGING MARKET, 2014-2022 ($MILLION)
FIGURE 30. COMPARATIVE REGIONAL MARKET SHARE ANALYSIS OF GLOBAL CERAMIC PACKAGE 3D SEMICONDUCTOR PACKAGING MARKET, 2015 & 2022 (%)
FIGURE 31. MARKET REVENUE & FORECAST OF GLOBAL CERAMIC PACKAGE 3D SEMICONDUCTOR PACKAGING MARKET, 2014-2022 ($MILLION)
FIGURE 32. COMPARATIVE REGIONAL MARKET SHARE ANALYSIS OF GLOBAL DIE ATTACH MATERIAL 3D SEMICONDUCTOR PACKAGING MARKET, 2015 & 2022 (%)
FIGURE 33. MARKET REVENUE & FORECAST OF GLOBAL DIE ATTACH MATERIAL 3D SEMICONDUCTOR PACKAGING MARKET, 2014-2022 ($MILLION)
FIGURE 34. COMPARATIVE REGIONAL MARKET SHARE ANALYSIS OF GLOBAL OTHERS 3D SEMICONDUCTOR PACKAGING MARKET, 2015 & 2022 (%)
FIGURE 35. MARKET REVENUE & FORECAST OF GLOBAL OTHERS 3D SEMICONDUCTOR PACKAGING MARKET, 2014-2022 ($MILLION)
FIGURE 36. COMPARATIVE REGIONAL MARKET SHARE ANALYSIS OF GLOBAL ELECTROCNICS 3D SEMICONDUCTOR PACKAGING MARKET, 2015 & 2022 (%)
FIGURE 37. MARKET REVENUE & FORECAST OF GLOBAL ELECTRONICS 3D SEMICONDUCTOR PACKAGING MARKET, 2014-2022 ($MILLION)
FIGURE 38. COMPARATIVE REGIONAL MARKET SHARE ANALYSIS OF GLOBAL INDUSTRIAL 3D SEMICONDUCTOR PACKAGING MARKET, 2015 & 2022 (%)
FIGURE 39. MARKET REVENUE & FORECAST OF GLOBAL INDUSTRIAL 3D SEMICONDUCTOR PACKAGING MARKET, 2014-2022 ($MILLION)
FIGURE 40. COMPARATIVE REGIONAL MARKET SHARE ANALYSIS OF GLOBAL IT & TELECOMMUNICATION 3D SEMICONDUCTOR PACKAGING MARKET, 2015 & 2022 (%)
FIGURE 41. MARKET REVENUE & FORECAST OF GLOBAL IT & TELECOMMUNICATION 3D SEMICONDUCTOR PACKAGING MARKET, 2014-2022 ($MILLION)
FIGURE 42. COMPARATIVE REGIONAL MARKET SHARE ANALYSIS OF GLOBAL HEALTHCARE 3D SEMICONDUCTOR PACKAGING MARKET, 2015 & 2022 (%)
FIGURE 43. MARKET REVENUE & FORECAST OF GLOBAL HEALTHCARE 3D SEMICONDUCTOR PACKAGING MARKET, 2014-2022 ($MILLION)
FIGURE 44. COMPARATIVE REGIONAL MARKET SHARE ANALYSIS OF GLOBAL AUTOMOTIVE & TRANSPORT 3D SEMICONDUCTOR PACKAGING MARKET, 2015 & 2022 (%)
FIGURE 45. MARKET REVENUE & FORECAST OF GLOBAL CERAMIC PACKAGE 3D SEMICONDUCTOR PACKAGING MARKET, 2014-2022 ($MILLION)
FIGURE 46. COMPARATIVE REGIONAL MARKET SHARE ANALYSIS OF GLOBAL AEROSPACE & DEFENSE 3D SEMICONDUCTOR PACKAGING MARKET, 2015 & 2022 (%)
FIGURE 47. MARKET REVENUE & FORECAST OF GLOBAL AEROSPACE & DEFENSE 3D SEMICONDUCTOR PACKAGING MARKET, 2014-2022 ($MILLION)
FIGURE 48. COMPARATIVE REGIONAL MARKET SHARE ANALYSIS OF GLOBAL OTHERS 3D SEMICONDUCTOR PACKAGING MARKET, 2015 & 2022 (%)
FIGURE 49. MARKET REVENUE & FORECAST OF GLOBAL OTHERS 3D SEMICONDUCTOR PACKAGING MARKET, 2014-2022 ($MILLION)
FIGURE 50. U.S.: 3D SEMICONDUCTOR PACKAGING MARKET SIZE, 2014-2022 ($MILLION)
FIGURE 51. CANADA: 3D SEMICONDUCTOR PACKAGING MARKET SIZE, 2014-2022 ($MILLION)
FIGURE 52. MEXICO: 3D SEMICONDUCTOR PACKAGING MARKET SIZE, 2014-2022 ($MILLION)
FIGURE 53. UK: 3D SEMICONDUCTOR PACKAGING MARKET SIZE, 2014-2022 ($MILLION)
FIGURE 54. GERMANY: 3D SEMICONDUCTOR PACKAGING MARKET SIZE, 2014-2022 ($MILLION)
FIGURE 55. FRANCE: 3D SEMICONDUCTOR PACKAGING MARKET SIZE, 2014-2022 ($MILLION)
FIGURE 56. FRANCE: 3D SEMICONDUCTOR PACKAGING MARKET SIZE, 2014-2022 ($MILLION)
FIGURE 57. REST OF EUROPE: 3D SMEICONDUCTOR PACKGAING MARKET SIZE, 2014-2022 ($MILLION)
FIGURE 58. CHINA: 3D SMEICONDUCTOR PACKGAING MARKET SIZE, 2014-2022 ($MILLION)
FIGURE 59. JAPAN: 3D SMEICONDUCTOR PACKGAING MARKET SIZE, 2014-2022 ($MILLION)
FIGURE 60. SOUTH KOREA: 3D SMEICONDUCTOR PACKGAING MARKET SIZE, 2014-2022 ($MILLION)
FIGURE 61. INDIA: 3D SMEICONDUCTOR PACKGAING MARKET SIZE, 2014-2022 ($MILLION)
FIGURE 62. REST OF ASIA-PACIFIC: 3D SMEICONDUCTOR PACKGAING MARKET SIZE, 2014-2022 ($MILLION)
FIGURE 63. LATIN AMERICA: 3D SEMICONDUCTOR PACKAGING MARKET SIZE, 2014-2022 ($MILLION)
FIGURE 64. MIDDLE EAST: 3D SEMICONDUCTOR PACKAGING MARKET SIZE, 2014-2022 ($MILLION)
FIGURE 65. AFRICA: 3D SEMICONDUCTOR PACKAGING MARKET SIZE, 2014-2022 ($MILLION)
FIGURE 66. AMKOR TECHNOLOGY, INC.: COMPANY SNAPSHOT
FIGURE 67. JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY: COMPANY SNAPSHOT
FIGURE 68. IBM CORPORTAION: COMPANY SNAPSHOT
FIGURE 69. QUALCOMM TECHNOLOGIES.: COMPANY SNAPSHOT
FIGURE 70. INTEL CORPORATION: COMPANY SNAPSHOT
FIGURE 71. TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY: COMPANY SNAPSHOT
FIGURE 72. STMICROELECTRONICS TECHNOLOGY, INC.: COMPANY SNAPSHOT
FIGURE 73. SPIL: COMPANY SNAPSHOT
FIGURE 74. SUSS MICROTEC AG: COMPANY SNAPSHOT
FIGURE 75. ASE GROUP: COMPANY SNAPSHOT

LIST OF TABLES

TABLE 1. GLOBAL 3D SEMICONDUCTOR PACKAGING MARKET, BY TECHNOLOGY, 2014-2022 ($MILLION)
TABLE 2. GLOBAL 3D TSV, SEMICONDUCTOR PACKAGING MARKET, BY GEOGRAPHY, 2014-2022 ($MILLION)
TABLE 3. GLOBAL 3D POP, SEMICONDUCTOR PACKAGING MARKET, BY GEOGRAPHY, 2014-2022 ($MILLION)
TABLE 4. GLOBAL 3D FAN OUT, SEMICONDUCTOR PACKAGING MARKET, BY GEOGRAPHY, 2014-2022 ($MILLION)
TABLE 5. GLOBAL 3D WIRE BONDED, SEMICONDUCTOR PACKAGING MARKET, BY GEOGRAPHY, 2014-2022 ($MILLION)
TABLE 6. GLOBAL OTHERS, 3D SEMICONDUCTOR PACKAGING MARKET, BY GEOGRAPHY, 2014-2022 ($MILLION)
TABLE 7. GLOBAL 3D SEMICONDUCTOR PACKAGING MARKET, BY MATERIAL, 2014-2022 ($MILLION)
TABLE 8. GLOBAL ORGANIC SUBSTRATE, 3D SEMICONDUCTOR PACKAGING MARKET, BY GEOGRAPHY, 2014-2022 ($MILLION)
TABLE 9. GLOBAL BONDING WIRE, 3D SEMICONDUCTOR PACKAGING MARKET, BY GEOGRAPHY, 2014-2022 ($MILLION)
TABLE 10. GLOBAL LEADFRAME, 3D SEMICONDUCTOR PACKAGING MARKET, BY GEOGRAPHY, 2014-2022 ($MILLION)
TABLE 11. GLOBAL ENCAPSULATION RESIN, 3D SEMICONDUCTOR PACKAGING MARKET, BY GEOGRAPHY, 2014-2022 ($MILLION)
TABLE 12. GLOBAL CERAMIC PACKAGE, 3D SEMICONDUCTOR PACKAGING MARKET, BY GEOGRAPHY, 2014-2022 ($MILLION)
TABLE 13. GLOBAL DIE ATTACH MATERIAL, 3D SEMICONDUCTOR PACKAGING MARKET, BY GEOGRAPHY, 2014-2022 ($MILLION)
TABLE 14. GLOBAL OTHERS, 3D SEMICONDUCTOR PACKAGING MARKET, BY GEOGRAPHY, 2014-2022 ($MILLION)
TABLE 15. GLOBAL 3D SEMICONDUCTOR PACKAGING MARKET, BY INDUSTRY VETRICAL, 2014-2022 ($MILLION)
TABLE 16. GLOBAL ELECTRONICS 3D SEMICONDUCTOR PACKAGING MARKET, BY GEOGRAPHY, 2014-2022 ($MILLION)
TABLE 17. GLOBAL INDUSTRIAL, 3D SEMICONDUCTOR PACKAGING MARKET, BY GEOGRAPHY, 2014-2022 ($MILLION)
TABLE 18. GLOBAL IT & TELECOMMUNICATION, 3D SEMICONDUCTOR PACKAGING MARKET, BY GEOGRAPHY, 2014-2022 ($MILLION)
TABLE 19. GLOBAL HEALTHCARE, 3D SEMICONDUCTOR PACKAGING MARKET, BY GEOGRAPHY, 2014-2022 ($MILLION)
TABLE 20. GLOBAL AUTOMOTIVE & TRANSPORT, 3D SEMICONDUCTOR PACKAGING MARKET, BY GEOGRAPHY, 2014-2022 ($MILLION)
TABLE 21. GLOBAL AEROSPACE & DEFENSE, 3D SEMICONDUCTOR PACKAGING MARKET, BY GEOGRAPHY, 2014-2022 ($MILLION)
TABLE 22. GLOBAL OTHERS, 3D SEMICONDUCTOR PACKAGING MARKET, BY GEOGRAPHY, 2014-2022 ($MILLION)
TABLE 23. 3D SEMICONDUCTOR PACKAGING MARKET, BY GEOGRAPHY, 2014-2022 ($MILLION)
TABLE 24. NORTH AMERICA: 3D SEMICONDUCTOR PACKAGING MARKET, BY TECHNOLOGY, 2014-2022 ($MILLION)
TABLE 25. NORTH AMERICA: 3D SEMICONDUCTOR PACKAGING MARKET, BY MATERIAL, 2014-2022 ($MILLION)
TABLE 26. NORTH AMERICA: 3D SEMICONDUCTOR PACKAGING MARKET, BY INDUSTRY VERTICAL, 2014-2022 ($MILLION)
TABLE 27. NORTH AMERICA: 3D SEMICONDUCTOR PACKAGING MARKET, BY COUNTRY, 2014-2022 ($MILLION)
TABLE 28. EUROPE: 3D SEMICONDUCTOR PACKAGING MARKET, BY TECHNOLOGY, 2014-2022 ($MILLION)
TABLE 29. EUROPE: 3D SEMICONDUCTOR PACKAGING MARKET, BY MATERIAL, 2014-2022 ($MILLION)
TABLE 30. EUROPE: MICRODISPLAY MARKET, BY INDUSTRY VETRICAL, 2014-2022 ($MILLION)
TABLE 31. EUROPE: 3D SEMICONDUCTOR PACKAGING MARKET, BY COUNTRY, 2014-2022 ($MILLION)
TABLE 32. ASIA-PACIFIC: 3D SMEICONDUCTOR PACKGAING MARKET, BY TECHNOLOGY, 2014-2022 ($MILLION)
TABLE 33. ASIA-PACIFIC: 3D SMEICONDUCTOR PACKGAING MARKET, BY MATERIAL, 2014-2022 ($MILLION)
TABLE 34. ASIA-PACIFIC: 3D SMEICONDUCTOR PACKGAING MARKET, BY INDUSTRY VETRICAL, 2014-2022 ($MILLION)
TABLE 35. ASIA-PACIFIC: 3D SMEICONDUCTOR PACKGAING MARKET, BY COUNTRY, 2014-2022 ($MILLION)
TABLE 36. LAMEA: 3D SEMICONDUCTOR PACKAGING MARKET, BY TECHNOLOGY, 2014-2022 ($MILLION)
TABLE 37. LAMEA: 3D SEMICONDUCTOR PACKAGING MARKET, BY MATERIAL, 2014-2022 ($MILLION)
TABLE 38. LAMEA: 3D SEMICONDUCTOR PACKAGING MARKET, BY INDUSTRY VERTICAL, 2014-2022 ($MILLION)
TABLE 39. LAMEA: 3D SEMICONDUCTOR PACKAGING MARKET, BY COUNTRY, 2014-2022 ($MILLION)
TABLE 40. AMKOR TECHNOLOGY, INC.: COMPANY SNAPSHOT
TABLE 41. AMKOR TECHNOLOGY, INC.: OPERATING SEGMENTS
TABLE 42. JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY: COMPANY SNAPSHOT
TABLE 43. JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY: OPERATING SEGMENTS
TABLE 44. IBM CORPORATION: COMPANY SNAPSHOT
TABLE 45. IBM CORPORATION: OPERATING SEGMENTS
TABLE 46. QUALCOMM TECHNOLOGIES.: COMPANY SNAPSHOT
TABLE 47. QUALCOMM TECHNOLOGIES: OPERATING SEGMENTS
TABLE 48. INTEL CORPORATION: COMPANY SNAPSHOT
TABLE 49. INTEL CORPORATION. OPERATING SEGMENTS
TABLE 50. TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY: COMPANY SNAPSHOT
TABLE 51. TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY: OPERATING SEGMENTS
TABLE 52. STMICROELECTRONICS TECHNOLOGY, INC.: COMPANY SNAPSHOT
TABLE 53. STMICROELECTRONICS TECHNOLOGY, INC.: OPERATING SEGMENTS
TABLE 54. SPIL: COMPANY SNAPSHOT
TABLE 55. SPIL: OPERATING SEGMENTS
TABLE 56. SUSS MICROTEC AG: COMPANY SNAPSHOT
TABLE 57. SUSS MICROTEC AG: OPERATING SEGMENTS
TABLE 58. ASE GROUP: COMPANY SNAPSHOT
TABLE 59. ASE GROUP: OPERATING SEGMENTS

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