About Chip-on-flex
COF is a type of chip-on-board (COB) process technology. The fundamentals of the COB process involve attaching die or a chip in place and wire bonding it directly to the substrate metallization, alongside other surface mount devices (SMD) attached by standard surface mount technology (SMT) processes. The process significantly improves lead time, footprint efficiency, and is affordable.
Technavio’s analysts forecast the global chip-on-flex market to grow at a CAGR of 4.42% during the period 2017-2021.
Covered in this report
The report covers the present scenario and the growth prospects of the global chip-on-flex market for 2017-2021. The report presents a detailed picture of the market by way of study, synthesis, and summation of data from multiple sources.
The market is divided into the following segments based on geography:
• Americas
• APAC
• EMEA
Technavio's report, Global Chip-on-flex Market 2017-2021, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.
Key vendors
• FLEXCEED Co., Ltd.
• Finetech
• SHENZHEN DANBOND TECHNOLOGY CO., LTD.
• AKM Industrial
Other prominent vendors
• Compunetix
• Stars Microelectronics
• Compass Technology
Market driver
• Increased R&D investments in flexible displays market
• For a full, detailed list, view our report
Market challenge
• Lag in mass production of flexible OLED displays
• For a full, detailed list, view our report
Market trend
• Increasing vertical integration
• For a full, detailed list, view our report
Key questions answered in this report
• What will the market size be in 2021 and what will the growth rate be?
• What are the key market trends?
• What is driving this market?
• What are the challenges to market growth?
• Who are the key vendors in this market space?
You can request one free hour of our analyst’s time when you purchase this market report. Details are provided within the report.
Table of Contents
PART 01: Executive summary
PART 02: Scope of the report
PART 03: Research Methodology
• Economic Indicators
PART 04: Introduction
• Market outline
PART 05: COB technology overview
• COB manufacturing process flow
• Advantages of COB LED technology
PART 06: Outlook
• Market overview
• Market size and forecast
• Five forces analysis
PART 07: Market segmentation by type
• Global COF market by type 2016-2021
• Single-sided COF
• Others
PART 08: Geographical segmentation
• Global COF market by geography 2016-2021
• APAC
• Americas
• EMEA
PART 09: Decision framework
PART 10: Drivers and challenges
• Market drivers
• Market challenges
PART 11: Market trends
• Increasing vertical integration
• Increasing popularity of rechargeable printed batteries
• Growth of innovative applications
• Increased availability of flexible devices
• Proliferation of printed electronics
PART 12: Vendor landscape
• Competitive scenario
PART 13: Key vendors
• Other prominent vendors
PART 14: Appendix
• List of abbreviations
List of Exhibits
Exhibit 01: COB manufacturing process flow
Exhibit 02: Advantages of COB LED
Exhibit 03: Global COF market 2016-2021 ($ millions)
Exhibit 04: Five forces analysis
Exhibit 05: Global COF market by type 2016-2021 (%)
Exhibit 06: Global COF market by type 2016-2021 ($ millions)
Exhibit 07: Global single-sided COF market 2016-2021 ($ millions)
Exhibit 08: Global other COF market 2016-2021 ($ millions)
Exhibit 09: Global COF market by geography 2016-2021 (%)
Exhibit 10: Global COF market by geography 2016-2021 ($ millions)
Exhibit 11: COF market in APAC 2016-2021 ($ millions)
Exhibit 12: COF market in Americas 2016-2021 ($ millions)
Exhibit 13: COF market in EMEA 2016-2021 ($ millions)
Exhibit 14: Printed electronics products of 2016
Exhibit 15: Ansoff Matrix
