About Sputtering Equipment
Sputtering is a thin film deposition manufacturing process used in semiconductor, disk drive, CD, and optical device manufacturing industries. The process is performed at the atomic level. The atoms of the source material are bombarded with high energy particles in vacuum. This leads to the deposition of a thin film onto a substrate, which can be a silicon wafer, a solar panel, or an optical device.
Technavio’s analysts forecast the global sputtering equipment market to grow at a CAGR of 3.84% during the period 2017-2021.
Covered in this report
The report covers the present scenario and the growth prospects of the global sputtering equipment market for 2017-2021. To calculate the market size, the report considers the revenue generated from the leading vendors of sputtering equipment.
The market is divided into the following segments based on geography:
• Americas
• APAC
• EMEA
Technavio's report, Global Sputtering Equipment Market 2017-2021, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.
Key vendors
• Applied Materials
• Canon Anelva Corporation
• Oerlikon
• ULVAC Technologies
Other prominent vendors
• BOBST
• IZOVAC
• JX Nippon Mining & Metals
• KOBE STEEL
• Kolzer
• Satisloh
Market driver
• Consumer electronics driving semiconductor equipment market
• For a full, detailed list, view our report
Market challenge
• Low returns from capital-intensive companies
• For a full, detailed list, view our report
Market trend
• Increasing demand for semiconductor ICs from automobiles
• For a full, detailed list, view our report
Key questions answered in this report
• What will the market size be in 2021 and what will the growth rate be?
• What are the key market trends?
• What is driving this market?
• What are the challenges to market growth?
• Who are the key vendors in this market space?
• What are the market opportunities and threats faced by the key vendors?
• What are the strengths and weaknesses of the key vendors?
You can request one free hour of our analyst’s time when you purchase this market report. Details are provided within the report.
Table of Contents
PART 01: Executive summary
PART 02: Scope of the report
PART 03: Research Methodology
PART 04: Introduction
• Key market highlights
PART 05: Market landscape
• Market overview
• Market size and forecast
• Five forces analysis
PART 06: Market segmentation by type
• Logic
• Memory
• Analog
• Discrete
PART 07: Market segmentation by application
• Consumer electronics
• Automotive sector
• Healthcare electronics
• Others
PART 08: Geographical segmentation
• Market overview
PART 09: Key leading countries
• Taiwan
• South Korea
• Japan
• China
PART 10: Market drivers
• Increased use of electronic semiconductor devices
• Consumer electronics driving semiconductor equipment industry
• Increased demand for miniaturized ICs
• Increasing number of fabless semiconductor companies
PART 11: Impact of drivers
PART 12: Market challenges
• Variations in semiconductor industry
• Impact of currency fluctuations
• Technological survival in the long run
PART 13: Impact of drivers and challenges
PART 14: Market trends
• Increasing demand for semiconductor ICs from automobiles
• IoT trending in the semiconductor market
• Transitions in wafer size
• Emerging FinFET architecture and 3D ICs
PART 15: Vendor landscape
• Competitive scenario
• Other prominent vendors
PART 16: Appendix
• List of abbreviations
PART 17: Explore Technavio
List of Exhibits
Exhibit 01: Key market highlights
Exhibit 02: Global sputtering equipment market overview
Exhibit 03: Global sputtering equipment market overview 2016-2021 ($ millions)
Exhibit 04: Five forces analysis
Exhibit 05: Types of semiconductor components
Exhibit 06: Global sputtering market by type 2016-2021 (revenue share)
Exhibit 07: Global sputtering equipment market by logic 2016-2021 ($ millions)
Exhibit 08: Global sputtering equipment market by memory 2016-2021 ($ millions)
Exhibit 09: Global sputtering market by analog 2016-2021($ millions)
Exhibit 10: global sputtering equipment market by discrete 2016-2021 ($ millions)
Exhibit 11: Global sputtering market by application
Exhibit 12: Global sputtering equipment market by application 2016-2021 (revenue share)
Exhibit 13: Global sputtering market in consumer electronics 2016-2021 ($ millions)
Exhibit 14: Global sputtering market in automotive sector 2016-2021 ($ millions)
Exhibit 15: Global sputtering market in healthcare electronics 2016-2021 ($ millions)
Exhibit 16: Global sputtering market in others segment 2016-2021 ($ millions)
Exhibit 17: Global sputtering equipment market by geography 2016 ($ millions)
Exhibit 18: Global sputtering equipment market by geography 2016-2021 (revenue share)
Exhibit 19: Sputtering equipment market in APAC ($ millions)
Exhibit 20: Top semiconductor manufacturers in APAC 2016
Exhibit 21: Fab equipment expenditure 2015-2017
Exhibit 22: Sputtering equipment market in Americas 2016-2021 ($ millions)
Exhibit 23: Top semiconductor manufacturers in US 2016
Exhibit 24: Sputtering equipment market in EMEA ($ millions)
Exhibit 25: Top semiconductor manufacturers in Europe 2016
Exhibit 26: Key leading countries
Exhibit 27: Semiconductor applications forecast 2016 and 2021 (% share)
Exhibit 28: Global NAND flash market 2016-2021 (% share)
Exhibit 29: Global MEMS market 2016-2021 ($ billions)
Exhibit 30: Market share of fabless companies and IDMs by region 2015 (revenue share)
Exhibit 31: Impact of drivers
Exhibit 32: Decreasing semiconductor revenue forecast (revenue share)
Exhibit 33: TWD per 1 USD monthly average 2016
Exhibit 34: Impact of drivers and challenges
Exhibit 35: IoT sensor and semiconductor hardware market forecast ($ billions)
Exhibit 36:0 mm and 450 mm wafer size forecast 2016 and 2021 (number of fabs)
Exhibit 37: Applied Materials: Business segmentation 2016 (revenue share)
Exhibit 38: Applied Materials: Product overview
Exhibit 39: Applied Materials: Recent developments
Exhibit 40: Canon Anelva Corporation: Product overview
Exhibit 41: ULVAC Technologies: Product overview
Exhibit 42: Other prominent vendors
