About Wire Bonder Equipment
Wire bonder equipment is the machinery used for making interconnects between an IC or any other semiconductor device at the time of packaging. This interconnection ensures the flow of electricity in the semiconductor device. The thin-wire used to make these connections are usually made of copper, gold, aluminum, or silver. Wire bonder equipment is part of the semiconductor assembly and packaging process.
Technavio’s analysts forecast the global wire bonder equipment market to grow at a CAGR of 2.88% during the period 2017-2021.
Covered in this report
The report covers the present scenario and the growth prospects of the global wire bonder equipment market for 2017-2021. To calculate the market size, the report considers the new installations, shipments, and sales of wire bonding systems in the semiconductor market.
The market is divided into the following segments based on geography:
• Americas
• APAC
• EMEA
Technavio's report, Global Wire Bonder Equipment Market 2017-2021, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the key vendors operating in this market.
Key vendors
• ASM Pacific Technology
• Kulicke& Soffa
• Palomar Technologies
Other prominent vendors
• Besi
• DIAS Automation
• F&K Delvotec Bondtechnik
• Hesse
• Hybond
• SHINKAWA Electric
• Toray Engineering
• West Bond
Market driver
• Incentives and discounts for long-term customers
• For a full, detailed list, view our report
Market challenge
• High investment market
• For a full, detailed list, view our report
Market trend
• Growing use of 3D chip packaging
• For a full, detailed list, view our report
Key questions answered in this report
• What will the market size be in 2021 and what will the growth rate be?
• What are the key market trends?
• What is driving this market?
• What are the challenges to market growth?
• Who are the key vendors in this market space?
• What are the market opportunities and threats faced by the key vendors?
• What are the strengths and weaknesses of the key vendors?
You can request one free hour of our analyst’s time when you purchase this market report. Details are provided within the report.
Table of Contents
PART 01: Executive summary
PART 02: Scope of the report
PART 03: Research Methodology
PART 04: Introduction
• Key market highlights
PART 05: Market landscape
• Overview of semiconductor packaging and assembly equipment
• Ecosystem of semiconductor IC packaging industry
• Wire bonder market overview
• Market size and forecast
• Five forces analysis
PART 06: Market segmentation by product
• Global wire bonder equipment market by product
• Ball bonders
• Stud-bump bonders
• Wedge bonders
PART 07: Market segmentation by end-user
• Global wire bonder equipment market by end-user
• OSATs
• Market size and forecast
PART 08: Geographical segmentation
• Global wire bonder equipment market by geography
• APAC
• Americas
• EMEA
PART 09: Key leading countries
• Key leading countries
• Taiwan
• South Korea
• Japan
• China
PART 10: Decision framework
PART 11: Drivers and challenges
• Market drivers
• Impact of drivers on key customer segments
• Market challenges
• Impact of challenges on key customer segments
PART 12: Market trends
• Growing use of 3D chip packaging
• Increase in number of OSAT vendors
• Trend of M&A in the packaging and assembly market
• Advent of FOWLP technology
• Automation in automobiles
PART 13: Vendor landscape
• Competitive scenario
• Key vendors
• Other prominent vendors
PART 14: Appendix
• List of abbreviations
List of Exhibits
Exhibit 01: Comparison of wire bonding techniques
Exhibit 02: Comparison of the three types of wire bonds
Exhibit 03: Steps involved in back-end chip formation
Exhibit 04: Supply chain of traditional semiconductor IC packaging industry
Exhibit 05: Supply chain of new semiconductor IC packaging industry
Exhibit 06: Overview of global wire bonder equipment market
Exhibit 07: Global wire bonder equipment market 2016-2021 ($ millions)
Exhibit 08: Five forces analysis
Exhibit 09: Global wire bonder equipment market by product 2016-2021 (% share of revenue)
Exhibit 10: Revenue trend line of global wire bonder equipment market by product 2016-2021 ($ millions)
Exhibit 11: Global ball bonder equipment market by ball bonders 2016-2021 ($ millions)
Exhibit 12: Global wire bonder equipment market by stud-bump bonders 2016-2021 ($ millions)
Exhibit 13: Global wedge bonder equipment market by wedge bonders 2016-2021 ($ millions)
Exhibit 14: Global wire bonder equipment market by end-user 2016-2021 (% share of revenue)
Exhibit 15: Revenue trend line of the global wire bonder equipment market by end-user 2016-2021 ($ millions)
Exhibit 16: Global wire bonder equipment market by OSATs 2016-2021 ($ millions)
Exhibit 17: Global wire bonder equipment market by IDMs 2016-2021 ($ millions)
Exhibit 18: Global wire bonder equipment market by geography 2016-2021 (% share of revenue)
Exhibit 19: Global wire bonder equipment market by geography ($ millions)
Exhibit 20: Wire bonder equipment market in APAC 2016-2021 ($ millions)
Exhibit 21: Wire bonder equipment market in Americas 2016-2021 ($ millions)
Exhibit 22: Wire bonder equipment market in EMEA 2016-2021 ($ millions)
Exhibit 23: Key leading countries
Exhibit 24: Percentage share of key leading countries 2016-2021
Exhibit 25: Forecast by application of semiconductor devices 2016 and 2021 (% share of unit shipments)
Exhibit 26: Impact of drivers
Exhibit 27: Global semiconductor market trend 1990-2016 ($ billions)
Exhibit 28: Impact of challenges
Exhibit 29: Other prominent vendors
